10M16SCU169A7G

The 10M16SCU169A7G is a MAX® 10 FPGA from Intel, delivering a compact, surface-mount programmable logic solution in a 169-LFBGA (169-UBGA, 11×11) package. It combines on-chip memory and a substantial number of logic elements with a 130-pin I/O count to address space-constrained embedded designs.

With AEC-Q100 qualification, a 2.85 V to 3.465 V supply range and an operating temperature span of −40 °C to 125 °C, this device is positioned for automotive and rugged embedded applications that require verified component-level qualification and extended temperature operation.

Key Features

• Logic Capacity — Provides 16,000 logic elements suitable for mid-range programmable logic tasks and custom control implementations.
• On-chip Memory — Includes 562,176 total RAM bits to support buffering, state machines, and local data storage without external memory.
• I/O Integration — 130 I/O pins available for flexible interfacing with sensors, actuators, peripherals and vehicle networks.
• Automotive Qualification — AEC-Q100 qualification indicates the device meets automotive semiconductor quality requirements.
• Power Supply Range — Operates from 2.85 V to 3.465 V, allowing use with common automotive and embedded system power rails.
• Extended Temperature Range — Rated for −40 °C to 125 °C operation to support thermally demanding environments.
• Package and Mounting — 169-LFBGA (169-UBGA, 11×11) surface-mount package for compact PCB designs.
• RoHS Compliant — Conforms to RoHS requirements for environmental compliance.

Typical Applications

• Automotive Systems — AEC-Q100 qualification and extended temperature range make it suitable for body electronics, gateway controllers, and vehicle sensor interfacing where component-level qualification is required.
• Embedded Control — 16,000 logic elements and on-chip RAM provide resources for custom control logic, protocol handling, and real-time processing in compact embedded products.
• I/O-Dense Interfaces — With 130 I/O pins, the device supports designs that need extensive peripheral, sensor, or actuator connections without large external glue logic.
• Memory-Dependent Logic — The 562,176 bits of RAM support buffering, lookup tables, and state retention for mid-complexity data-path and control functions.

Unique Advantages

• Automotive-Grade Qualification: AEC-Q100 certification provides a verifiable quality baseline for vehicle-level designs.
• Balanced Logic and Memory: 16,000 logic elements paired with 562,176 RAM bits deliver a practical balance for control, interfacing, and moderate data handling on a single device.
• High I/O Count: 130 I/O pins reduce the need for external multiplexing or expanders, simplifying board design and lowering BOM complexity.
• Wide Operating Conditions: Support for −40 °C to 125 °C operation and a 2.85 V–3.465 V supply range enables use across varied thermal and power environments.
• Compact Surface-Mount Package: 169-LFBGA (11×11) package delivers a small PCB footprint while retaining ample I/O and logic resources.
• RoHS Compliance: Meets environmental compliance requirements for modern manufacturing and product deployment.

Why Choose 10M16SCU169A7G?

The 10M16SCU169A7G offers a well-rounded FPGA option for designers seeking a qualified, compact programmable device with meaningful logic capacity, substantial on-chip RAM and a high pin count. Its AEC-Q100 qualification and extended temperature rating make it appropriate for automotive and similarly demanding embedded environments where component qualification and reliability are essential.

This device is suited to engineers building mid-complexity control, interfacing and processing functions who need a single-component solution to reduce BOM and board area while maintaining verified quality and environmental compliance. As an Intel-manufactured MAX® 10 FPGA, it provides a clear, specification-driven choice for automotive and embedded procurement and design cycles.

Request a quote or submit a procurement inquiry to check availability and pricing for the 10M16SCU169A7G and to discuss volume needs or delivery timelines.