10M16SCU169I7P

The 10M16SCU169I7P is an Intel MAX® 10 FPGA device supplied in a 169‑LFBGA (169‑UBGA, 11×11) package. It provides on‑device logic and memory resources appropriate for industrial embedded systems that require reconfigurable logic in a compact surface‑mount package.

Key attributes include 16,000 logic elements, 562,176 bits of on‑chip RAM, 130 I/O pins, an industrial operating temperature range (‑40 °C to 100 °C), and a core voltage supply range of 1.15 V to 1.25 V.

Key Features

• Logic Capacity — 16,000 logic elements to implement custom digital logic, state machines, and glue‑logic functions.
• On‑Chip Memory — 562,176 total RAM bits for data buffering, small lookup tables, and local storage without external memory.
• I/O Count — 130 general‑purpose I/O pins to interface with sensors, actuators, and peripheral devices.
• Package & Mounting — 169‑LFBGA (supplier device package listed as 169‑UBGA, 11×11) in a surface‑mount form factor for compact board layouts.
• Voltage Supply — Core supply range of 1.15 V to 1.25 V to match system power‑rail design requirements.
• Industrial Grade — Specified operating temperature from ‑40 °C to 100 °C suitable for industrial environments.
• Standards & Compliance — RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Industrial Control — Use the device’s industrial temperature rating and 130 I/O to implement sensor interfacing, motor control logic, and field I/O aggregation.
• Embedded Logic and Edge Processing — 16,000 logic elements and 562,176 RAM bits enable on‑device data processing and protocol handling at the edge.
• Human‑Machine Interfaces (HMI) — Leverage the I/O count and compact 169‑LFBGA package for display controllers, keypad handling, and peripheral bridging in space‑constrained designs.

Unique Advantages

• Balanced Logic and Memory Density: 16,000 logic elements combined with 562,176 RAM bits provide a mid‑range resource set for versatile design implementation.
• Industrial Reliability: Rated for ‑40 °C to 100 °C operation to meet common industrial deployment requirements.
• Compact BGA Packaging: 169‑LFBGA / 169‑UBGA (11×11) allows higher I/O density in constrained PCB real estate.
• Flexible I/O Availability: 130 I/O pins simplify interfacing to multiple peripherals without immediate need for I/O expanders.
• Low‑Voltage Core Compatibility: 1.15 V–1.25 V supply range supports integration into modern low‑voltage power domains.
• RoHS Compliant: Supports regulatory and environmental requirements for equipment manufacturing.

Why Choose 10M16SCU169I7P?

The 10M16SCU169I7P positions itself as a compact, industrial‑grade FPGA option within the Intel MAX® 10 family, delivering a practical mix of logic resources, on‑chip RAM, and I/O capacity in a surface‑mount 169‑LFBGA package. Its specified operating temperature range and RoHS compliance make it suitable for industrial embedded applications where board space and environmental resilience matter.

Designers targeting mid‑density reconfigurable logic for control, edge processing, or HMI tasks will find the combination of 16,000 logic elements, substantial on‑chip RAM, and 130 I/O useful for reducing external component count and simplifying system architecture.

Request a quote or submit an inquiry to evaluate 10M16SCU169I7P for your design requirements and to obtain pricing and availability information.