10M16SCU324C8G

The Intel MAX® 10 FPGA 10M16SCU324C8G is a field-programmable gate array in a 324-LFBGA package that integrates on-chip logic, memory, and I/O to implement custom digital functions. This device provides 16,000 logic elements, 562,176 total RAM bits and 246 I/O pins in a 324-UBGA (15x15) surface-mount package.

Designed for commercial-grade applications, the device operates from a 2.85 V to 3.465 V supply and supports an operating temperature range of 0 °C to 85 °C. The part is RoHS compliant and is documented in the Intel MAX 10 FPGA device datasheet.

Key Features

• Core Logic — 16,000 logic elements provide the programmable fabric required for custom digital logic implementations.
• On-chip Memory — 562,176 total RAM bits available for data buffering, state machines, and local storage.
• I/O Capacity — 246 I/O pins support extensive external interfacing and parallel connectivity.
• Package & Mounting — 324-LFBGA package, supplier device package 324-UBGA (15x15), designed for surface-mount PCB assembly.
• Power Supply Range — Operates from 2.85 V to 3.465 V, enabling compatibility with targeted system power rails.
• Commercial Temperature Grade — Specified for 0 °C to 85 °C operation for commercial applications.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Programmable logic designs — Use the 16,000 logic elements to implement custom finite-state machines, address decoding, and glue logic in board-level designs.
• I/O-intensive systems — 246 I/O pins enable broad external connectivity for sensor interfacing, bus bridging, and parallel device control.
• Memory-rich functions — With 562,176 RAM bits, implement data buffers, FIFOs, and small on-chip data structures without external RAM.

Unique Advantages

• Integrated Logic and Memory: Combines 16,000 logic elements with over half a million RAM bits to reduce dependence on external components.
• High I/O Density: 246 I/O pins simplify routing for multi-device interfaces and parallel peripherals.
• Compact Surface-Mount Package: 324-LFBGA (324-UBGA, 15x15) provides a small footprint for space-constrained PCBs.
• Commercial Temperature Support: Specified 0 °C to 85 °C operation for deployment in standard commercial environments.
• Wide Supply Voltage Window: 2.85 V to 3.465 V supply range supports integration with common system power rails.
• Standards Compliance: RoHS compliant to meet common environmental requirements.

Why Choose 10M16SCU324C8G?

The 10M16SCU324C8G provides a balanced combination of logic density, on-chip memory, and broad I/O in a compact LFBGA package, making it suitable for designs that require significant programmable logic and local RAM without adding external memory. Its commercial temperature rating and RoHS compliance align with standard production and environmental requirements.

As an Intel MAX® 10 device, this part is documented in the Intel MAX 10 FPGA device datasheet, enabling engineering teams to evaluate electrical characteristics, timing, and configuration details during development and procurement.

Request a quote or submit an RFQ to start a procurement conversation for the 10M16SCU324C8G and receive pricing, availability, and lead-time information from authorized distributors.