10M16SLY180C8G

The 10M16SLY180C8G is a MAX® 10 field programmable gate array (FPGA) from Intel supplied in a 180-UFBGA/WLCSP package. It provides a balanced combination of programmable logic, on-chip RAM, and I/O density for commercial-grade embedded designs.

With 16,000 logic elements, 562,176 total RAM bits and 125 user I/Os, this device targets compact, integration-focused applications that require moderate logic capacity and significant on-chip memory within a space-efficient package.

Key Features

• Core / Logic  16,000 logic elements provide the programmable fabric for datapath, control logic and custom accelerators.
• Memory  562,176 total RAM bits available on-chip for buffering, FIFOs, and state storage.
• I/O  125 user I/O pins to interface with peripherals, sensors, and external devices.
• Power  Operates from a 2.85 V to 3.465 V supply range, allowing integration with common commercial voltage domains.
• Package  180-UFBGA, WLCSP package; supplier device package listed as 180-YBGA (6.08 × 5.09 mm) for high-density board implementations.
• Mounting  Surface-mount device suitable for modern PCB assembly flows.
• Temperature & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Commercial embedded systems  Use the device's 16,000 logic elements and 125 I/Os to implement custom control, protocol bridging or user-interface logic in commercial products.
• Memory-rich logic functions  Leverage 562,176 RAM bits for buffering, packet memory, or state machines where on-chip storage reduces external memory dependence.
• Space-constrained designs  The 180-UFBGA/WLCSP (180-YBGA, 6.08 × 5.09 mm) package supports compact PCB layouts and high-density integrations.

Unique Advantages

• Balanced logic and memory capacity: 16,000 logic elements paired with 562,176 RAM bits provide on-chip resources for mixed compute and storage requirements.
• Generous I/O count: 125 I/Os enable flexible interfacing to sensors, peripherals and external devices without immediate need for I/O expanders.
• Compact package footprint: 180-UFBGA/WLCSP (180-YBGA, 6.08 × 5.09 mm) supports dense board-level integration in space-limited products.
• Commercial temperature qualification: Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial applications.
• RoHS compliant: Conforms to lead-free environmental requirements for global commercial product supply chains.
• Standard surface-mount form factor: Surface-mount mounting enables compatibility with common assembly and manufacturing processes.

Why Choose 10M16SLY180C8G?

The 10M16SLY180C8G positions itself as a compact, memory-rich FPGA solution for commercial designs that need a blend of programmable logic, significant on-chip RAM and a substantial I/O count in a small package. Its voltage range and surface-mount 180-UFBGA/WLCSP packaging make it suitable for dense board layouts where board space and integration matter.

This device is a practical choice for development teams and OEMs seeking a commercially rated FPGA option with clear, verifiable specifications: 16,000 logic elements, 562,176 RAM bits and 125 I/Os. Its RoHS compliance and standard mounting help simplify procurement and manufacturing for commercial product lines.

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