10M25DAF256C8G

The 10M25DAF256C8G is a MAX® 10 Field Programmable Gate Array (FPGA) IC from Intel in a 256-LBGA package. It integrates up to 25,000 logic elements, 691,200 bits of on-chip RAM and supports up to 178 user I/O in a surface-mount 256-ball package.

Engineered for commercial applications, this device targets designs that require moderate logic density, substantial embedded RAM, and flexible I/O count within a compact 17 mm × 17 mm supplier package footprint.

Key Features

• Core logic  25,000 logic elements (Number Of Logic Elements Cells: 25000) to implement programmable logic and control functions.
• Embedded memory  691,200 total RAM bits available for on-chip buffering, FIFOs, and state storage.
• High I/O count  Up to 178 user I/O pins to support multiple parallel interfaces and peripheral connections.
• Power supply  Operates from a core supply range of 1.15 V to 1.25 V as specified.
• Package and mounting  256-LBGA package case with supplier device package listed as 256-FBGA (17×17); surface-mount assembly.
• Commercial temperature grade  Rated for operation from 0 °C to 85 °C, suitable for commercial-environment deployments.
• Standards compliance  RoHS compliant, supporting regulatory requirements for lead-free assemblies.
• Detailed technical documentation  Device datasheet includes electrical characteristics, switching characteristics, configuration specifications, and timing information to support design and verification.

Typical Applications

• Commercial embedded control  Use the FPGA’s 25,000 logic elements and 178 I/O to implement control logic, state machines, and peripheral interfaces in commercial products.
• Interface bridging and protocol handling  Leverage the available I/O and on-chip RAM for protocol conversion, buffering, and glue-logic between subsystems.
• Prototyping and proof-of-concept systems  The combination of logic density and embedded RAM makes the device suitable for early-stage development and functional validation in commercial designs.

Unique Advantages

• Balanced integration: Combines 25,000 logic elements with 691,200 bits of RAM and 178 I/O to consolidate logic, memory, and connectivity on a single device.
• Compact packaging: 256-ball BGA in a 17×17 supplier footprint enables a high-density implementation while maintaining a small board area.
• Commercial temperature rating: 0 °C to 85 °C rating aligns with standard commercial product environments and deployment conditions.
• Low-voltage core operation: Core supply range of 1.15 V–1.25 V supports contemporary low-voltage FPGA power architectures.
• Regulatory readiness: RoHS compliance helps meet lead-free assembly requirements for commercial products.
• Documented design data: Comprehensive datasheet coverage for electrical, switching, configuration and timing parameters supports engineering integration and verification.

Why Choose 10M25DAF256C8G?

The 10M25DAF256C8G positions itself as a commercially rated, mid-density MAX® 10 FPGA that integrates substantial on-chip RAM, a high number of I/O, and a compact BGA package. It is suited to designers who need programmable logic capacity (25,000 logic elements) combined with embedded memory (691,200 bits) and flexible connectivity in a surface-mount 256-ball footprint.

For commercial product teams and engineers requiring documented electrical and timing specifications, the device’s datasheet provides detailed configuration and performance information to aid design, verification, and integration into production platforms.

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