10M25DAF256I6G

The 10M25DAF256I6G is an Intel MAX® 10 field programmable gate array (FPGA) in a 256‑ball LBGA package. It provides 25,000 logic elements and 691,200 bits of on‑chip RAM in a compact surface‑mount footprint suitable for space‑constrained, board‑level integration.

Designed for industrial applications, the device offers a 178‑pin I/O count and an operating temperature range of ‑40 °C to 100 °C, with a core voltage supply range of 1.15 V to 1.25 V. These characteristics make it appropriate for embedded control, custom logic acceleration, and I/O‑dense implementations requiring extended temperature operation.

Key Features

• Core Logic  25,000 logic elements provide a flexible fabric for implementing custom digital functions, accelerators, and glue logic.
• On‑Chip Memory  691,200 bits of total RAM support buffering, FIFOs, and small data‑store implementations without external memory.
• I/O Capacity  178 general‑purpose I/O pins enable broad interfacing to sensors, actuators, peripherals, and bus fabrics.
• Package & Mounting  256‑LBGA (17×17) surface‑mount package balances pin count and board density for compact system designs.
• Power Supply  Nominal core voltage range of 1.15 V to 1.25 V for compatibility with the device’s internal core requirements.
• Temperature & Grade  Industrial grade device rated for operation from ‑40 °C to 100 °C.
• RoHS Compliant  Meets RoHS requirements for lead‑free manufacturing and environmental compliance.

Typical Applications

• Industrial Automation  Industrial grade operation and extended temperature range support control and monitoring systems for factory automation and process control.
• Embedded Signal Processing  On‑chip RAM and 25,000 logic elements enable custom filtering, aggregation, and low‑latency data paths in edge devices.
• Sensor and I/O Aggregation  High I/O count simplifies interfacing to multiple sensors, ADCs/DACs, and digital peripherals for gateway and sensor‑fusion tasks.
• Custom Logic and Protocol Bridging  Programmable fabric is suitable for implementing bespoke interfaces, protocol conversion, and glue logic in compact systems.

Unique Advantages

• Substantial Logic Capacity: 25,000 logic elements provide headroom for complex state machines, combinational logic, and embedded controllers.
• Significant On‑Chip Memory: 691,200 bits of RAM reduce reliance on external memory for buffering and small data structures, simplifying board design.
• High I/O Density: 178 I/O pins enable broad peripheral connectivity and multi‑channel interfacing without external multiplexing.
• Industrial‑Grade Reliability: Rated for ‑40 °C to 100 °C operation, suitable for demanding environmental conditions.
• Compact Package: 256‑LBGA (17×17) package offers a balance of pin count and PCB area for space‑constrained applications.
• Regulatory Compliance: RoHS compliance supports lead‑free manufacturing and environmental requirements.

Why Choose 10M25DAF256I6G?

The 10M25DAF256I6G brings together a sizable logic fabric, ample on‑chip memory, and a high I/O count in a compact 256‑LBGA package tailored for industrial embedded designs. Its industrial temperature rating and RoHS compliance make it a practical choice for long‑life deployments where environmental tolerance and regulatory conformance matter.

This part suits engineers and procurement teams seeking a programmable, board‑level FPGA solution that reduces external component count while supporting I/O‑heavy and memory‑sensitive designs. The specification set offers practical scalability for a range of control, interfacing, and signal‑processing tasks within the MAX® 10 family framework.

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