10M25DAF484C7G

The 10M25DAF484C7G is a MAX® 10 family FPGA offered in a 484-ball FBGA package, designed for commercial applications. It provides a programmable logic fabric with 25,000 logic elements, large on-chip RAM, and a high I/O count to support complex glue logic, interface consolidation, and custom control functions.

With a low-voltage core supply and a commercial operating temperature range, this device is suited to standard embedded and system designs that require integrated programmable logic with dense I/O and on-chip memory.

Key Features

• Logic Capacity — 25,000 logic elements for implementing custom logic, state machines, and glue logic in a single device.
• On‑Chip Memory — 691,200 total RAM bits to support buffering, FIFOs, and small data storage without external memory.
• I/O Density — 360 user I/Os to accommodate multiple interfaces, buses, and peripheral connections.
• Core Voltage — 1.15 V to 1.25 V supply range for the FPGA core.
• Package and Mounting — 484-FBGA (23 × 23 mm) package in a 484-ball BGA footprint; surface-mount mounting type supports compact board layouts.
• Operating Temperature — Commercial grade 0 °C to 85 °C for standard temperature environments.
• RoHS Compliance — Device is RoHS compliant to meet environmental and manufacturing requirements.

Typical Applications

• Custom Logic and Glue — Use the 25,000 logic elements and abundant I/Os to replace multiple discrete components with a single programmable device for board-level integration.
• Interface Aggregation — 360 I/Os and on-chip RAM enable consolidation of multiple peripheral interfaces and local buffering without external components.
• Embedded Control — Implement control engines, sequencers, and real-time logic for commercial embedded systems within the provided operating temperature and voltage ranges.

Unique Advantages

• High Logic Density: 25,000 logic elements provide the capacity to implement substantial custom logic and state machines on-chip.
• Significant On‑Chip Memory: 691,200 RAM bits reduce reliance on external memory for small-to-moderate buffering and data storage needs.
• Extensive I/O Count: 360 I/Os support multiple parallel interfaces and flexible board-level connectivity.
• Compact, Surface‑Mount Package: 484-FBGA (23 × 23 mm) enables high-density PCB designs while keeping the device footprint manageable.
• Commercial‑Grade Operation: 0 °C to 85 °C rating and RoHS compliance make the device suitable for standard commercial deployments.
• Low‑Voltage Core: 1.15 V–1.25 V core supply supports modern power-optimized system designs.

Why Choose 10M25DAF484C7G?

The 10M25DAF484C7G balances substantial programmable logic capacity, on-chip RAM, and a high I/O count in a compact 484-FBGA package for commercial embedded and system designs. Its specification set makes it appropriate for engineers seeking to consolidate interfaces, implement custom control logic, or reduce board-level component count while operating within standard commercial temperature and power constraints.

Designed for projects that require a mix of logic density, memory, and I/O flexibility, this MAX® 10 device offers a clear, verifiable specification profile to support procurement and system design decisions with predictable electrical and thermal parameters.

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