10M25DAF484I6G

The 10M25DAF484I6G is an Intel MAX® 10 FPGA delivered in a 484‑BGA (484‑FBGA, 23×23) package. It provides a balanced combination of programmable logic, on‑chip memory, and I/O density for embedded and industrial applications.

Key attributes include 25,000 logic elements, 691,200 bits of on‑chip RAM, 360 user I/Os, an industrial operating temperature range of ‑40 °C to 100 °C, and a core voltage range of 1.15 V to 1.25 V—making it suitable for designs that require sustained operation across extended environmental conditions.

Key Features

• Programmable Logic — 25,000 logic elements provide substantial capacity for glue logic, control engines, and custom datapath implementations.
• On‑Chip Memory — 691,200 bits of embedded RAM support buffering, FIFOs, and small local memories without external DRAM.
• I/O Density — 360 available I/Os accommodate multi‑interface systems, sensor arrays, and peripheral connectivity.
• Industrial Grade and Speed — Device is graded Industrial with a speed grade of I6 as indicated by the part number and supported device grades.
• Power Range — Core supply specified between 1.15 V and 1.25 V to match system power architectures.
• Package and Mounting — 484‑BGA (484‑FBGA, 23×23) surface‑mount package for compact board integration.
• Operating Temperature — Rated for operation from ‑40 °C to 100 °C for deployment in temperature‑challenging environments.
• RoHS Compliant — Meets RoHS requirements for lead‑free assembly and environmental compliance.

Typical Applications

• Industrial Control — On‑chip memory and 25,000 logic elements enable control algorithms, PLC interfaces, and deterministic I/O handling across the specified industrial temperature range.
• Motor and Drive Systems — High I/O count and programmable logic capacity support sensor inputs, PWM generation, and real‑time control functions.
• Embedded Interface and Glue Logic — Use the FPGA for protocol bridging, bus interfacing, and custom logic that reduces external component count.
• Data Acquisition and Signal Conditioning — Local RAM and abundant I/O allow buffering and preprocessing of sensor streams before passing data to host systems.

Unique Advantages

• Integrated Logic and Memory: 25,000 logic elements paired with 691,200 bits of RAM reduce reliance on external components and simplify board design.
• High I/O Capacity: 360 user I/Os provide flexibility for multi‑interface designs and numerous peripheral connections without multiplexing compromises.
• Industrial Temperature Support: Rated from ‑40 °C to 100 °C for reliable operation in factory and field environments.
• Compact, Surface‑Mount Package: 484‑FBGA (23×23) offers a small footprint for space‑constrained PCBs while retaining routing options for complex systems.
• Defined Core Voltage Range: 1.15 V–1.25 V specification allows straightforward power supply planning for the FPGA core.
• Regulatory Compliance: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose 10M25DAF484I6G?

The 10M25DAF484I6G combines meaningful logic density, substantial on‑chip RAM, and a high I/O count in an industrial‑grade MAX® 10 FPGA package. It is well suited to engineers who need a single, programmable device to implement control logic, protocol conversion, and data buffering while maintaining operation across wide temperature ranges.

Choosing this part provides a scalable platform for embedded and industrial designs that require integration of logic and memory on a compact board footprint, with clear electrical and environmental specifications for system planning.

Request a quote or submit a purchase inquiry for the 10M25DAF484I6G to begin procurement and integration planning.