10M25DAF484C8G

The 10M25DAF484C8G is an Intel MAX® 10 field programmable gate array (FPGA) supplied in a 484-FBGA (23×23) surface-mount package. It delivers a balanced combination of programmable logic, on-chip RAM, and high I/O count targeted at commercial electronic designs requiring compact, integrated programmable logic.

This commercial-grade device operates from a 1.15 V to 1.25 V core supply and supports an ambient operating range of 0 °C to 85 °C, making it suitable for a wide range of standard commercial applications where RoHS compliance and surface-mount integration are required.

Key Features

• Logic Capacity — 25,000 logic elements provide substantial programmable logic resources for implementing custom digital functions and control logic.
• On‑Chip Memory — 691,200 total RAM bits enable local buffering, state storage, and small-data processing without external memory.
• I/O Resources — 360 general-purpose I/O pins support dense external interfacing for peripherals, sensors, and buses.
• Package and Mounting — 484-FBGA (23×23) package in a surface-mount form factor simplifies board-level integration in compact assemblies.
• Power — Core voltage range of 1.15 V to 1.25 V to match system power rails and design constraints.
• Operating Range — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant for environmental and regulatory conformity in commercial products.

Typical Applications

• Commercial Embedded Systems — Implement custom logic, glue logic, or protocol handling in space-constrained, surface-mount designs.
• Peripheral and Sensor Interfaces — Aggregate and manage multiple sensor or peripheral signals using the device’s 360 I/O pins and on-chip RAM.
• Prototyping and Low‑Volume Production — Use the programmable fabric for design iteration, hardware acceleration of algorithms, and small-batch products where integration and reconfigurability are valuable.

Unique Advantages

• High Logic Density: 25,000 logic elements allow complex logic implementation without external CPLDs or multiple devices, reducing board complexity.
• Substantial On‑Chip RAM: 691,200 RAM bits provide local storage for buffering and state machines, reducing the need for external memory components.
• Extensive I/O Count: 360 I/O pins support rich peripheral connectivity and flexible interfacing options.
• Compact Surface‑Mount Package: 484-FBGA (23×23) enables high-density PCB layouts while maintaining robust soldered connections for production assembly.
• Commercial Temperature and RoHS Compliance: Operational 0 °C to 85 °C range and RoHS compliance meet common commercial product and regulatory requirements.

Why Choose 10M25DAF484C8G?

The 10M25DAF484C8G provides a balanced combination of programmable logic capacity, on-chip RAM, and high I/O count in a compact 484-FBGA surface-mount package. Its commercial-grade specification and RoHS compliance make it a practical choice for designers building compact, reconfigurable digital systems for commercial markets.

This part is well suited for teams that need to consolidate logic and interfacing into a single, solderable FPGA device, enabling reduced BOM complexity, streamlined PCB layout, and the flexibility to iterate designs through reprogramming.

Request a quote or submit a procurement inquiry to obtain pricing and availability information for the 10M25DAF484C8G.