10M25DAF256I7P

The 10M25DAF256I7P is an Intel MAX® 10 FPGA device delivered in a 256-LBGA package, offering a combination of on-chip logic, RAM, and configurable I/O in a surface-mount form factor. This device targets designs that require up to 25,000 logic elements, 691,200 bits of on-chip RAM, and 178 user I/Os within an industrial-grade temperature range.

Key value comes from integration and compact packaging: a low-voltage core (1.15 V to 1.25 V), substantial on-chip memory, and a high IO count suitable for space-constrained industrial applications that need programmable digital logic and system-level integration.

Key Features

• Logic Capacity — 25,000 logic elements and 1,563 logic blocks provide programmable logic resources for custom digital designs.
• On‑Chip Memory — 691,200 total RAM bits enable local data buffering, FIFOs, and small embedded memory structures without external RAM.
• High I/O Count — 178 user I/Os support a wide range of peripheral interfaces and board-level connectivity.
• Power and Core Voltage — Core supply range of 1.15 V to 1.25 V suitable for modern low-voltage FPGA designs.
• Industrial Temperature Rating — Specified operating range of −40 °C to 100 °C for deployment in industrial environments.
• Package and Mounting — 256-LBGA (supplier package: 256-FBGA 17×17) in a surface-mount package for compact PCB layouts.
• Compliance — RoHS-compliant manufacturing.

Typical Applications

• Industrial Control — Implement programmable control logic, signal processing, and interface bridging within industrial temperature and packaging constraints.
• Custom Digital Functions — Replace fixed-function glue logic with configurable logic elements and on-chip RAM to consolidate board-level functions.
• Embedded System Integration — Combine logic, memory, and high-count I/O in a single 256-LBGA package for compact embedded designs.

Unique Advantages

• Integrated Memory and Logic: 691,200 bits of on-chip RAM paired with 25,000 logic elements reduces reliance on external memory and simplifies BOM.
• High I/O Density: 178 user I/Os enable flexible interfacing to peripherals, sensors, and external controllers without additional IO expanders.
• Industrial‑Grade Operation: −40 °C to 100 °C operating range supports deployments in demanding thermal environments.
• Compact BGA Package: 256-LBGA (17×17 FBGA mapping) balances board space efficiency with routing capability for complex designs.
• Low-Voltage Core: 1.15 V to 1.25 V core supply aligns with contemporary low-power FPGA families and power architectures.
• RoHS Compliant: Designed and produced in compliance with RoHS requirements for environmental and regulatory alignment.

Why Choose 10M25DAF256I7P?

The 10M25DAF256I7P positions itself as a tightly integrated FPGA solution for engineers who need substantial programmable logic, on-chip memory, and a high pin count in a compact BGA package. Its industrial temperature rating and RoHS compliance make it suitable for long-lived industrial designs demanding reliable operation across a wide thermal range.

This device is well suited for designs that require consolidation of digital functions, local RAM for buffering and state storage, and flexible I/O mapping — providing a balance of capacity, integration, and packaging that supports scalable system designs backed by Intel's MAX 10 device documentation.

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