10M25DAF256C7G

The 10M25DAF256C7G is a MAX® 10 Field Programmable Gate Array (FPGA) from Intel, delivered in a 256-LBGA package. It provides a mid-range FPGA fabric with 25,000 logic elements, 691,200 bits of on-chip RAM, and 178 user I/Os for configurable digital logic and I/O aggregation in commercial electronic systems.

Designed for surface-mount assembly and commercial-temperature operation, this device balances integration and I/O capacity while operating from a 1.15 V to 1.25 V core supply. RoHS compliance supports integration into modern, lead-free product designs.

Key Features

• Core Logic 25,000 logic elements provide programmable combinatorial and sequential resources for implementing custom digital functions and control logic.
• On-Chip Memory 691,200 total RAM bits offer embedded storage for FIFOs, buffers, and state machines without external memory.
• I/O Capacity 178 user I/Os enable broad external interfacing and parallel signal handling for sensors, peripherals, and buses.
• Power Supply Core voltage support from 1.15 V to 1.25 V to match low-voltage system architectures.
• Package & Mounting 256-LBGA (supplier package: 256-FBGA 17×17) in a surface-mount form factor for compact board layouts.
• Operating Range & Grade Commercial-grade device rated for 0 °C to 85 °C operation and RoHS compliant for lead-free assemblies.

Typical Applications

• Embedded Control Implement custom control logic and state machines for commercial embedded devices using available logic elements and on-chip RAM.
• Interface Bridging Aggregate and translate multiple parallel and serial interfaces using the 178 I/Os to connect peripherals and subsystems.
• Prototyping & Development Use the MAX® 10 device for hardware prototyping and system validation where reprogrammable logic and ample RAM are required.
• Test & Measurement Equipment Build data capture, buffering, and real-time processing blocks leveraging the device’s on-chip memory and I/O density.

Unique Advantages

• Balanced Integration: Combines 25,000 logic elements with 691,200 bits of RAM to implement complex logic and local data storage without immediate need for external memory.
• High I/O Count: 178 user I/Os provide flexibility for connecting multiple sensors, peripherals, and bus interfaces in a single device.
• Compact Surface-Mount Package: 256-LBGA (256-FBGA 17×17) supports high-density board designs while maintaining a standard surface-mount assembly flow.
• Low-Voltage Core Compatibility: Operates from 1.15 V to 1.25 V core supply to integrate with modern low-voltage system power domains.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial electronic products.
• RoHS Compliant: Meets lead-free assembly requirements for contemporary manufacturing processes.

Why Choose 10M25DAF256C7G?

The 10M25DAF256C7G offers a practical combination of programmable logic density, significant on-chip RAM, and substantial I/O capability in a compact 256-LBGA surface-mount package. Its commercial temperature rating and RoHS compliance make it suitable for mainstream electronics projects that require reconfigurable logic and local memory resources.

This FPGA is well suited for designers building commercial embedded systems, interface bridges, prototyping platforms, and test equipment that need a scalable, reprogrammable logic element with onboard memory and ample I/O. The device’s specification set supports straightforward integration into low-voltage system architectures.

Request a quote or submit a purchase inquiry to receive pricing and availability for the 10M25DAF256C7G. Our team can provide lead-time details and assist with volume requirements.