10M16SLY180I8G

The 10M16SLY180I8G is an Intel MAX® 10 field-programmable gate array (FPGA) supplied in a 180-UFBGA WLCSP package. This device provides on-chip programmable logic with 16,000 logic elements, 562,176 total RAM bits, and 125 user I/Os.

Designed and specified for industrial-grade operation, the device supports a supply voltage range of 2.85 V to 3.465 V and an operating temperature range of −40 °C to 100 °C, enabling deployment in temperature-demanding environments where stable logic, memory, and I/O density are required.

Key Features

• Logic Capacity  16,000 logic elements provide programmable fabric for glue logic, finite-state machines, and custom datapaths.
• On-chip Memory  562,176 total RAM bits for buffering, FIFOs, and small on-chip data storage.
• I/O Count  125 user I/Os to support multiple external interfaces and board-level signals.
• Package  180-UFBGA, WLCSP (supplier device package 180-YBGA, 6.08 × 5.09 mm) for compact board integration.
• Power  Supported supply voltage range from 2.85 V to 3.465 V to accommodate common system rail choices.
• Industrial Grade Temperature  Specified operating temperature range of −40 °C to 100 °C for reliable operation in harsh environments.
• RoHS Compliant  Meets RoHS environmental requirements.

Typical Applications

• Custom Logic Integration  Systems that require up to 16,000 logic elements and flexible I/O mapping can implement glue logic, protocol bridging, and custom control functions on this device.
• On-board Data Buffering  Designs needing local RAM for buffering and temporary storage can use the 562,176 RAM bits to implement FIFOs, small caches, and temporary data structures.
• High I/O Count Modules  Modules requiring many external signals can leverage the 125 user I/Os for interfacing with sensors, peripherals, or other digital subsystems.
• Industrial Temperature Systems  Applications that operate across −40 °C to 100 °C can deploy this industrial-grade device where temperature resilience is required.

Unique Advantages

• Balanced Logic and Memory Density: 16,000 logic elements paired with 562,176 RAM bits allow mixed compute and buffering tasks within a single FPGA fabric.
• Compact, Board-Friendly Package: The 180-UFBGA WLCSP footprint (6.08 × 5.09 mm supplier package) supports space-constrained PCB designs without sacrificing I/O count.
• Wide Operating Temperature Window: −40 °C to 100 °C rating supports deployment in demanding environmental conditions.
• Flexible Power Options: Support for 2.85 V to 3.465 V supplies enables compatibility with common system rails.
• Standards-Conscious Supply: RoHS compliance addresses environmental and regulatory considerations for modern product development.

Why Choose 10M16SLY180I8G?

The 10M16SLY180I8G provides a practical balance of programmable logic capacity, on-chip memory, and I/O resources in a compact WLCSP package. Its industrial temperature rating and defined supply range make it suitable for applications that require reliable digital integration under temperature stress.

This device is appropriate for engineers and procurement teams seeking a MAX® 10 FPGA variant with 16,000 logic elements, significant on-chip RAM, and a high I/O count in a small-footprint package for space-constrained or ruggedized designs.

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