10M25DCF256A7G

The 10M25DCF256A7G is a MAX® 10 family FPGA in a 256‑FBGA (17×17) surface-mount package, offering a mid-range logic density and on-chip memory for embedded designs. It combines 25,000 logic elements with 691,200 bits of total RAM and up to 178 I/Os to enable compact, highly integrated digital implementations.

Designed and qualified for automotive use with AEC‑Q100, this device supports a 1.15 V supply and an operating temperature range of −40 °C to 125 °C, addressing designs that require robust thermal performance and automotive-grade qualification.

Key Features

• Core Logic  Provides 25,000 logic elements suitable for mid-range custom logic, control, and glue‑logic implementations.
• On‑chip Memory  Includes 691,200 bits of total RAM to support buffering, state machines, and moderate data storage directly on the FPGA.
• I/O Density  Up to 178 general-purpose I/O pins for flexible interfacing to sensors, peripherals, and system buses.
• Power  Single supply voltage specified at 1.15 V, enabling predictable power provisioning for system design.
• Package & Mounting  256‑FBGA (17×17) supplier device package in a surface-mount format; shipping/package case: tray.
• Automotive Qualification & Temperature  AEC‑Q100 qualification and an operating range of −40 °C to 125 °C for deployment in temperature‑challenging environments.

Typical Applications

• Automotive Systems  Use in automotive subsystems where AEC‑Q100 qualification and a −40 °C to 125 °C operating window are required for reliable operation.
• Embedded Control  Implement control logic and custom state machines that leverage 25,000 logic elements and on‑chip RAM for compact designs.
• I/O‑Rich Interfaces  Serve as a protocol bridge or interface controller where up to 178 I/Os provide the necessary connectivity.

Unique Advantages

• Balanced Logic and Memory:  25,000 logic elements combined with 691,200 bits of RAM provide a useful balance of compute and storage for mid-range FPGA tasks.
• High I/O Count:  178 I/O pins allow dense peripheral connectivity without external multiplexing.
• Automotive‑Grade Qualification:  AEC‑Q100 qualification and wide operating temperature support dependable use in automotive applications.
• Compact FBGA Package:  256‑FBGA (17×17) offers a small footprint for space‑constrained boards while maintaining ample I/O.
• Predictable Power Requirement:  A defined 1.15 V supply simplifies power rail planning and system integration.

Why Choose 10M25DCF256A7G?

The 10M25DCF256A7G positions itself as a compact, automotive‑qualified FPGA solution that delivers a practical combination of logic capacity, on‑chip RAM, and I/O density in a 256‑FBGA package. Its AEC‑Q100 qualification and −40 °C to 125 °C operating range make it appropriate for designs that require automotive reliability and a stable supply voltage of 1.15 V.

Choose this device for mid-range embedded and automotive projects that need integrated logic, memory, and connectivity in a single surface‑mount package, enabling reduced board complexity and predictable thermal and electrical behavior.

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