10M25DCF256I6G

The 10M25DCF256I6G is an Intel MAX® 10 field programmable gate array (FPGA) device, delivering 25,000 logic elements and 691,200 bits of on-chip RAM in a compact 256‑LBGA package. This industrial‑grade FPGA supports a wide range of programmable digital functions while providing a broad I/O count and a controlled core voltage range.

Designed for embedded and system designs that require significant programmable logic and memory resources, the device combines high I/O density (178 I/O) with industrial operating tolerance and surface‑mount packaging for board‑level integration.

Key Features

• Programmable Logic — 25,000 logic elements (logic cells) to implement custom digital functions and state machines.
• On‑chip Memory — 691,200 total RAM bits for data buffering, FIFOs, and local storage without external memory.
• I/O Density — 178 I/O pins supporting diverse signal interfacing and board partitioning needs.
• Power and Core Voltage — Core supply range of 1.15 V to 1.25 V, enabling predictable power domain planning.
• Package and Mounting — 256‑LBGA (supplier package: 256‑FBGA, 17×17) in a surface‑mount form factor for compact boards.
• Industrial Grade and Temperature — Rated for industrial operation with an operating temperature range of −40 °C to 100 °C.
• Standards Compliance — RoHS compliant for environmental and process conformity.

Typical Applications

• Embedded digital systems — Implement glue logic, custom state machines, and protocol handling using the device’s 25,000 logic elements and on‑chip RAM.
• I/O‑intensive interfaces — Use the 178 I/O pins to aggregate and adapt multiple peripheral signals or bridge disparate interfaces on a single FPGA.
• Industrial control and automation — Leverage industrial grade temperature range (−40 °C to 100 °C) and surface‑mount packaging for robust system integration in industrial environments.

Unique Advantages

• High integration in a compact package: 25,000 logic elements and 691,200 bits of RAM reduce external component count and simplify board design.
• Generous I/O for system partitioning: 178 I/O pins support complex interfacing without requiring additional bridge devices.
• Industrial operating envelope: −40 °C to 100 °C rating aligns with demanding environmental requirements for industrial applications.
• Predictable power domain design: Defined core voltage range (1.15 V–1.25 V) assists power supply selection and thermal planning.
• Surface‑mount 256‑LBGA packaging: Compact 17×17 FBGA footprint enables dense PCB layouts and automated assembly.
• RoHS compliant: Meets environmental compliance expectations for modern electronics manufacturing.

Why Choose 10M25DCF256I6G?

The 10M25DCF256I6G positions itself as a flexible, industrial‑grade FPGA option within the Intel MAX® 10 family, offering a balance of substantial logic resources, sizable on‑chip RAM, and high I/O count in a small BGA footprint. Its defined core voltage range and industrial temperature rating make it suitable for embedded and control applications that require reliable, board‑level programmable logic.

Engineers and procurement teams seeking a programmable device with clear, verifiable specifications—25,000 logic elements, 691,200 RAM bits, 178 I/O, and a 256‑LBGA package—will find this part appropriate for designs where integration density and predictable operating conditions are priorities.

Request a quote or submit a procurement inquiry to check availability and pricing for the 10M25DCF256I6G.