10M25DCF484C8G

The 10M25DCF484C8G is a MAX® 10 Field Programmable Gate Array (FPGA) IC from Intel, offering 25,000 logic elements and 691,200 total RAM bits in a compact 484‑FBGA (23×23) package. This commercial‑grade FPGA provides a balance of programmable logic capacity, on‑chip memory, and extensive I/O for configurable digital designs.

With 360 I/O pins, surface‑mount packaging, and a nominal supply range of 1.15 V to 1.25 V, this device is suitable for commercial applications that require dense integration of logic, memory, and interface connectivity within a 0 °C to 85 °C operating range. The device is RoHS compliant.

Key Features

• Logic Capacity 25,000 logic elements provide ample programmable resources for custom digital functions and mid‑range FPGA designs.
• On‑Chip Memory 691,200 total RAM bits support buffering, state storage, and data‑path requirements without external memory.
• I/O Density 360 I/O pins enable high peripheral and interface connectivity for multi‑channel systems and complex board designs.
• Package and Mounting 484‑FBGA (23×23) package in a surface‑mount form factor provides a compact solution for board‑level integration.
• Power Operates from a supply range of 1.15 V to 1.25 V, allowing straightforward power planning for designs targeting this voltage domain.
• Temperature and Grade Commercial grade operation from 0 °C to 85 °C; RoHS compliant for regulatory alignment in commercial products.

Typical Applications

• Commercial embedded systems – Programmable logic and on‑chip memory make it suitable for configurable control and processing tasks in commercial devices.
• I/O‑intensive interface boards – Large I/O count supports dense peripheral connectivity and multiple interface channels on a single device.
• Memory‑centric logic functions – Substantial on‑chip RAM enables buffering, packet processing, and stateful logic without immediate reliance on external memory.
• High‑density board integration – 484‑FBGA package and surface‑mount mounting simplify integration into space‑constrained PCBs.

Unique Advantages

• High programmable density: 25,000 logic elements deliver a large pool of resources for implementing complex logic and custom hardware accelerators.
• Significant on‑chip RAM: 691,200 RAM bits reduce dependence on external memory, simplifying BOM and board layout for many designs.
• Extensive I/O connectivity: 360 I/O pins provide flexibility to interface with sensors, peripherals, and multiple I/O standards on a single device.
• Compact BGA packaging: 484‑FBGA (23×23) provides a space‑efficient footprint for high‑density board designs while supporting surface‑mount assembly.
• Predictable power window: Narrow supply range (1.15 V–1.25 V) assists in efficient power supply design and management.
• Commercial and regulatory suitability: Designed for commercial temperature operation and RoHS compliance for use in a broad range of commercial products.

Why Choose 10M25DCF484C8G?

The 10M25DCF484C8G positions itself as a versatile, mid‑range FPGA solution that combines substantial logic capacity, generous on‑chip RAM, and a high I/O count in a compact 484‑FBGA package. As part of Intel's MAX® 10 family, it provides the integration and configurability needed for commercial embedded designs that require on‑chip memory and dense interface connectivity.

This device is well suited for designers and engineers building commercial products that need scalable programmable logic, reduced external memory dependency, and a compact board footprint. Its combination of features supports iterative development and integration into long‑lifecycle commercial applications.

Request a quote or submit a quote today to check availability and pricing for the 10M25DCF484C8G.