10M25DCF484C7G

The 10M25DCF484C7G is a MAX® 10 Field Programmable Gate Array (FPGA) IC from Intel supplied in a 484-FBGA (23×23) package. It combines a high logic capacity with substantial on-chip RAM and a large I/O count for compact, board-level programmable designs.

Designed for commercial-grade applications, the device targets designs that require up to 25,000 logic elements, 691,200 bits of RAM and up to 360 I/O while operating from a 1.15 V to 1.25 V supply and within a 0 °C to 85 °C temperature range.

Key Features

• Logic Capacity — 25,000 logic elements provide substantial programmable logic resources for complex combinational and sequential functions.
• On-chip Memory — 691,200 bits of total RAM support buffering, state storage and data handling within the FPGA fabric.
• I/O Density — Up to 360 I/O pins enable extensive external interfacing and flexible board-level connectivity options.
• Power — Operates from a 1.15 V to 1.25 V supply, allowing designs that target low-voltage FPGA implementations.
• Package and Mounting — 484-FBGA (23×23) package in a 484-BGA footprint with surface-mount mounting for compact PCB integration.
• Operating Range — Commercial-grade operating temperature from 0 °C to 85 °C suitable for standard commercial environments.
• RoHS Compliant — Meets RoHS environmental requirements for lead-free assembly and materials.

Typical Applications

• I/O-Intensive Embedded Systems — Leverages up to 360 I/O and 25,000 logic elements for designs that require extensive external interfacing and programmable logic.
• Memory-Dependent Logic — Uses 691,200 bits of on-chip RAM for applications needing significant internal buffering or data storage.
• Compact Board-Level Integration — The 484-FBGA package and surface-mount mounting make the device suitable for space-constrained PCB layouts.

Unique Advantages

• High Logic Density: 25,000 logic elements allow consolidation of multiple functions into a single device, reducing component count.
• Substantial On-Chip RAM: 691,200 bits of RAM reduce dependence on external memory for many data-centric tasks.
• Large I/O Count: 360 I/O simplifies system partitioning by providing broad external connectivity without additional multiplexing hardware.
• Compact Packaging: 484-FBGA (23×23) enables high-density PCB designs while keeping the FPGA footprint manageable.
• Commercial-Grade Availability: Rated for 0 °C to 85 °C, the device suits standard commercial environment deployments.
• RoHS Compliant: Supports lead-free manufacturing and regulatory conformity for many markets.

Why Choose 10M25DCF484C7G?

The 10M25DCF484C7G delivers a balanced mix of logic capacity, on-chip memory and I/O resources in a compact 484-FBGA package, making it a practical choice for commercial embedded designs that require substantial programmable logic and interface density. Its low-voltage operation and RoHS compliance support modern board-level implementations with attention to power and environmental requirements.

This FPGA is suited to developers and procurement teams building systems that need scalable logic, ample internal RAM and a high number of I/O pins in a surface-mount BGA footprint—providing a concise, integrated building block for mid-range FPGA applications.

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