10M25DCF484A7G

The 10M25DCF484A7G is a MAX® 10 Field Programmable Gate Array (FPGA) from Intel, delivered in a 484-BGA (484-FBGA 23×23) surface-mount package. It integrates up to 25,000 logic elements and 691,200 bits of on-chip RAM to address compact, high-density digital designs.

With 360 general-purpose I/O pins, AEC-Q100 qualification, and an operating range from −40 °C to 125 °C, this device targets designs that require significant programmable logic and memory capacity within an automotive-qualified form factor.

Key Features

• Core Logic  Provides 25,000 logic elements for implementing complex digital functions and custom hardware acceleration.
• On-chip Memory  691,200 total RAM bits enable local buffering, data processing, and state storage without external memory for many designs.
• I/O Capacity  360 I/O pins support high-connectivity applications and dense peripheral interfacing in a single device.
• Power Supply  Operates from a voltage supply range of 1.15 V to 1.25 V to match system power architectures.
• Package and Mounting  484-FBGA (23×23) package in a surface-mount form factor delivers a compact footprint for space-constrained boards.
• Automotive Qualification & Temperature  AEC-Q100 qualification and an operating temperature range of −40 °C to 125 °C support deployment in temperature-critical automotive environments.
• Manufacturer  Produced by Intel, ensuring production traceability and established supply-channel sourcing.

Typical Applications

• Automotive Systems  Designed for in-vehicle electronics where AEC-Q100 qualification and −40 °C to 125 °C operation are required.
• High-density I/O Systems  Ideal for applications that need many external interfaces, leveraging the device’s 360 I/O pins and 484-BGA package.
• Embedded Logic and Memory Integration  Suited to embedded designs that benefit from 25,000 logic elements and 691,200 bits of RAM for local processing and buffering.

Unique Advantages

• Automotive-qualified hardware: AEC-Q100 qualification and wide operating temperature support deliver suitability for automotive electronic applications.
• High on-chip memory: 691,200 RAM bits reduce reliance on external memory, simplifying BOM and board routing.
• Substantial logic capacity: 25,000 logic elements enable implementation of complex digital functions and customization without discrete ASIC development.
• Extensive I/O count: 360 I/Os provide flexibility to interface with numerous peripherals and sensors directly.
• Compact, surface-mount packaging: 484-FBGA (23×23) supports high-density board designs while maintaining manufacturable SMT assembly.
• Controlled supply voltage: 1.15–1.25 V operation aligns with modern low-voltage system rails for power-efficient designs.

Why Choose 10M25DCF484A7G?

The 10M25DCF484A7G balances substantial programmable logic and on-chip memory with a high I/O count and automotive-grade qualification, making it a practical choice for designers needing a reliable, compact FPGA solution for temperature-challenging environments. Its combination of 25,000 logic elements, 691,200 RAM bits, and 360 I/Os in a 484-FBGA package supports integration of complex functions while minimizing external components.

This device suits teams and programs aiming to consolidate functionality into a single, automotive-qualified FPGA—reducing board complexity and streamlining product development for embedded and in-vehicle electronic systems.

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