10M25DCF484I7G

The 10M25DCF484I7G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) in a 484‑ball BGA package. It combines reconfigurable logic, on‑chip memory, and a high I/O count to support industrial-grade embedded designs.

Designed for systems that require mid‑density programmable logic with robust operating range and compact packaging, the device delivers 25,000 logic elements, 691,200 bits of on‑chip RAM and 360 I/O pins in a 484‑FBGA (23×23) footprint.

Key Features

• Core Logic  Approximately 25,000 logic elements for implementing custom digital functions and control logic.
• Memory  691,200 total RAM bits of on‑chip memory to support buffering, state storage, and small embedded data structures.
• I/O and Packaging  360 available I/O pins in a 484‑FBGA (23×23) package; surface‑mount construction suitable for compact board layouts.
• Power  Core voltage supply range of 1.15 V to 1.25 V to match system power rails and enable predictable power budgeting.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet common industrial environmental requirements.
• Device Grade and Compliance  Industrial grade device; RoHS compliant.
• Documentation  Supported by Intel MAX 10 FPGA device documentation covering electrical characteristics, switching characteristics, configuration specifications, and timing parameters.

Typical Applications

• Industrial Control  Implements custom control logic and I/O aggregation for factory automation and process control using the device's 25,000 logic elements and wide temperature range.
• Embedded Processing and Glue Logic  Bridges interfaces and offloads deterministic tasks from a main processor leveraging on‑chip RAM and abundant I/O.
• Sensor and Actuator Interfaces  Consolidates multiple sensor inputs and drive signals with flexible I/O and programmable logic.
• High‑Density Board Designs  Compact 484‑FBGA package enables high‑functionality designs where board real estate is constrained.

Unique Advantages

• Well‑balanced logic and memory capacity: 25,000 logic elements combined with 691,200 bits of RAM support moderate complexity designs without external FPGA memory.
• High I/O density: 360 I/O pins provide flexibility for multi‑signal interfaces and parallel peripheral connections.
• Industrial thermal range: Rated −40 °C to 100 °C for deployment in temperature‑challenging environments.
• Compact BGA packaging: 484‑FBGA (23×23) delivers high integration in space‑constrained layouts while supporting surface‑mount assembly.
• Predictable power envelope: Defined core supply range (1.15 V–1.25 V) helps with system power planning and regulator selection.
• Regulatory readiness: RoHS compliance simplifies integration into lead‑free manufacturing flows.

Why Choose 10M25DCF484I7G?

The 10M25DCF484I7G positions itself as a mid‑density, industrial‑grade FPGA option that balances logic capacity, on‑chip memory, and a high I/O count in a compact 484‑FBGA package. Its specified operating temperature range and RoHS compliance make it suitable for controls and embedded applications that require reliable operation across environmental extremes.

Engineers selecting this device benefit from Intel MAX 10 family documentation covering electrical, switching, configuration, and timing characteristics, enabling predictable design integration and verification for production systems.

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