10M25SCE144C8G

The 10M25SCE144C8G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) in a 144‑LQFP exposed‑pad, surface‑mount package. It delivers 25,000 logic elements, 691,200 bits of on‑chip RAM and 101 usable I/O pins in a commercial‑grade device designed for programmable logic and embedded control applications.

This device operates from a 2.85 V to 3.465 V supply and is specified for 0 °C to 85 °C operation. It is RoHS‑compliant and intended for surface‑mount assembly in compact PCB implementations.

Key Features

• Logic Capacity  25,000 logic elements provide programmable logic resources for custom control, glue‑logic and datapath implementation.
• On‑chip Memory  691,200 total RAM bits for embedded buffering, small data stores and state machine storage without external memory.
• Programmable I/O  101 I/O pins enable multiple peripheral interfaces and signal connections directly from the device.
• Package & Mounting  144‑LQFP exposed pad (supplier package listed as 144‑EQFP, 20×20) in a surface‑mount form factor for compact board layouts and thermal coupling through the exposed pad.
• Supply Voltage  Operates from 2.85 V to 3.465 V, matching common 3.3 V‑class system rails.
• Operating Temperature  Rated for commercial use from 0 °C to 85 °C.
• Compliance  RoHS‑compliant construction for regulatory compatibility.

Typical Applications

• Embedded Control  Implement custom state machines, timing logic and control interfaces using the device’s logic elements and I/O resources.
• Protocol Bridging & I/O Expansion  Use the 101 I/O pins to route and translate signals between subsystems without additional discrete glue logic.
• On‑chip Data Buffering  Leverage 691,200 bits of RAM for packet buffering, FIFOs or small local storage to reduce external memory requirements.
• Prototyping & Development  Compact LQFP packaging and surface‑mount mounting make the device suitable for board‑level prototypes and proof‑of‑concept designs.

Unique Advantages

• Substantial logic in a compact package: 25,000 logic elements in a 144‑LQFP exposed‑pad package help keep PCB footprint small while providing substantial programmable capability.
• On‑chip RAM reduces BOM: 691,200 bits of internal RAM lower or eliminate the need for external memory in many buffering and state storage use cases.
• Flexible I/O count: 101 I/O pins offer design flexibility for connecting peripherals, sensors and control signals directly to the FPGA.
• Surface‑mount thermal path: Exposed‑pad LQFP package supports improved board thermal coupling and simplified assembly for surface‑mount production.
• Commercial temperature rating: Specified for 0 °C to 85 °C operation to match a wide range of commercial electronics applications.
• RoHS‑compliant: Built to meet RoHS requirements for environmentally compliant designs.

Why Choose 10M25SCE144C8G?

The 10M25SCE144C8G provides a balanced combination of programmable logic capacity, on‑chip RAM and I/O density in a compact surface‑mount package. Its electrical and package specifications make it well suited for commercial embedded designs that require integrated logic, local memory and a flexible I/O count without expanding board area or BOM complexity.

This device is appropriate for designers seeking a commercially rated Intel MAX 10 FPGA with clear supply and temperature specifications, straightforward board mounting (144‑LQFP exposed pad) and RoHS compliance for production deployment.

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