10M40DAF256C8G

The 10M40DAF256C8G is an Intel MAX® 10 FPGA device supplied in a 256-LBGA package. It integrates 40,000 logic elements, 1,290,240 bits of on-chip RAM and up to 178 I/O pins in a surface-mount BGA footprint for compact commercial designs.

Designed for commercial embedded applications, this MAX 10 device delivers a balance of logic density, on-chip memory and flexible I/O while operating from a 1.15 V to 1.25 V supply and across a 0 °C to 85 °C temperature range. The device is RoHS compliant and follows the MAX 10 device family specification for configuration and timing.

Key Features

• Core Logic  40,000 logic elements (logic cells) for implementing combinational and sequential logic functionality at moderate to high capacity.
• On‑Chip Memory  1,290,240 total RAM bits provide substantial embedded memory for FIFOs, buffering and local data storage without external memory.
• I/O Capacity & Flexibility  Up to 178 I/O pins support a variety of parallel and serial interfacing requirements; the MAX 10 datasheet documents programmable I/O delay features for timing tuning.
• Power & Core Voltage  Core supply voltage range of 1.15 V to 1.25 V for low‑voltage operation consistent with modern FPGA power domains.
• Package & Mounting  256‑LBGA package (supplier package: 256‑FBGA 17×17) in a surface-mount form factor to minimize board area and support compact PCB layouts.
• Operating Range & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C suitable for standard commercial environments.
• Configuration & Test  Device documentation includes configuration specifications and JTAG timing parameters as part of the Intel MAX 10 FPGA device datasheet.
• Standards Compliance  RoHS compliant to meet environmental and manufacturing requirements for lead‑free production.

Typical Applications

• Commercial Embedded Systems  Integration of control logic, protocol bridging and custom processing in space-constrained, commercial electronic products using the device's logic density and on-chip RAM.
• Communications and Interface Bridging  Implement protocol converters, interface glue logic or packet buffering leveraging up to 178 I/O pins and substantial RAM resources.
• Consumer Electronics  Feature control, sensor aggregation and user‑interface handling in consumer devices where a compact 256‑LBGA package and surface‑mount mounting are beneficial.
• Prototyping and Development  Hardware validation, algorithm acceleration and proof‑of‑concept designs that require reprogrammable logic, on-chip RAM and standard configuration/JTAG support.

Unique Advantages

• High Logic Capacity: 40,000 logic elements enable implementation of substantial custom logic without immediate need for larger discrete FPGA families.
• Large On‑Chip RAM: 1,290,240 bits of embedded RAM reduce or eliminate dependence on external memory for many buffering and storage tasks.
• Flexible I/O Count: 178 I/O pins provide headroom for multiple peripherals, buses and interface requirements on a single device.
• Compact BGA Package: 256‑LBGA (256‑FBGA 17×17) minimizes PCB area while providing a high pin count for dense designs.
• Low‑Voltage Core Operation: 1.15 V to 1.25 V supply range supports modern low-voltage system designs.
• Commercial Temperature Rating & RoHS Compliance: Rated 0 °C to 85 °C and RoHS compliant for mainstream commercial products and manufacturing flows.

Why Choose 10M40DAF256C8G?

The 10M40DAF256C8G positions itself as a commercially graded, mid-to-high density FPGA option within the Intel MAX 10 family, combining 40,000 logic elements, more than 1.29 Mb of on-chip RAM and up to 178 I/O in a compact 256‑LBGA package. Its low-voltage core and documented configuration and JTAG timing characteristics make it a practical choice for commercial embedded designs that require integrated memory and flexible interfacing without external components.

This device is suitable for design teams looking to consolidate logic and buffering into a single programmable device while maintaining a compact board footprint and standard commercial temperature operation. The MAX 10 datasheet provides detailed electrical, configuration and timing information required for system integration and validation.

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