10M25SCE144I7G

The 10M25SCE144I7G is a MAX® 10 Field Programmable Gate Array (FPGA) from Intel, offering up to 25,000 logic elements and extensive embedded RAM for mid-density programmable logic designs. It is packaged in a 144-LQFP with exposed pad and is supplied for industrial-grade applications.

With 1,563 logic blocks, 691,200 bits of on-chip RAM and 101 I/Os, this device is suited to designs that require balanced logic capacity, significant memory resources, and flexible I/O in a surface-mount package operating across a wide industrial temperature range.

Key Features

• Core Capacity — 25,000 logic elements and 1,563 logic blocks provide ample programmable logic resources for mid-density designs.
• On-Chip Memory — 691,200 total RAM bits available for buffering, state storage, and custom memory structures.
• I/O — 101 general-purpose I/Os to support multi-channel interfacing and peripheral connectivity.
• Power — Single-supply operation over a 2.85 V to 3.465 V range to match common system power rails.
• Package & Mounting — 144-LQFP exposed pad package (supplier device package: 144-EQFP, 20 × 20 mm) designed for surface-mount assembly.
• Industrial Temperature Range — Qualified for operation from −40 °C to 100 °C for use in industrial environments.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Industrial-grade operation and wide temperature range make the device suitable for control logic and I/O aggregation in factory and process automation systems.
• Embedded Processing — 25,000 logic elements and substantial on-chip RAM support custom embedded datapaths and accelerators for mid-range systems.
• I/O Expansion and Bridging — With 101 I/Os, the FPGA can implement protocol bridging, glue logic, and multi-channel sensor interfaces.

Unique Advantages

• Balanced Logic and Memory — The combination of 25,000 logic elements and 691,200 RAM bits supports complex logic alongside sizeable on-chip data storage without external memory.
• Ample I/O Count — 101 I/Os enable flexible connectivity to peripherals and sensors, reducing the need for external interface ICs.
• Industrial Reliability — Specified for −40 °C to 100 °C operation and listed as industrial grade, suitable for demanding environments.
• Standard Surface-Mount Package — 144‑LQFP exposed pad (20 × 20 mm equivalent) simplifies PCB layout and thermal management for production assemblies.
• Single-Supply Convenience — Operation across a 2.85 V to 3.465 V supply range aligns with common system rails to simplify power design.
• Environmental Compliance — RoHS compliance supports regulatory and corporate sustainability requirements.

Why Choose 10M25SCE144I7G?

The 10M25SCE144I7G delivers a practical blend of logic capacity, on-chip RAM, and I/O count in a production-ready industrial package—making it a solid choice for mid-density programmable logic applications that require robustness and flexibility. Its single-supply voltage range, exposed-pad 144-LQFP package, and RoHS compliance simplify system integration and manufacturing.

Manufactured by Intel and built to operate across a wide temperature range, the device is appropriate for engineering teams looking for a scalable FPGA building block that balances performance and integration for industrial and embedded designs.

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