10M16SCU169A7P

The 10M16SCU169A7P is an Intel MAX® 10 FPGA in a 169-LFBGA package providing reprogrammable logic in a compact surface-mount form factor. It offers 16,000 logic elements, 562,176 bits of on-chip RAM and up to 130 general-purpose I/O pins, making it suitable for embedded and automotive electronics that require integrated programmable logic, significant on-chip memory, and a high I/O count.

Designed with automotive qualification (AEC-Q100) and a wide operating range, this device supports deployment across harsh environments where temperature and reliability matter. The device operates from 2.85 V to 3.465 V and is RoHS compliant.

Key Features

• Core Logic — 16,000 logic elements to implement combinational and sequential logic, state machines, and custom interfaces.
• On-chip Memory — 562,176 total RAM bits provide embedded storage for buffering, lookup tables, and data processing without external memory.
• I/O Capacity — 130 I/O pins support diverse peripheral and sensor interfacing directly from the FPGA.
• Package & Mounting — 169-LFBGA (supplier package: 169-UBGA, 11×11) in a surface-mount format for compact PCB integration.
• Automotive Qualification — AEC-Q100 qualification and an operating temperature range of −40 °C to 125 °C for automotive-grade applications.
• Power — Supported supply voltage range of 2.85 V to 3.465 V, allowing compatibility with common system power rails.
• Regulatory — RoHS compliant, supporting environmental and manufacturing requirements.

Typical Applications

• Automotive control systems — AEC-Q100 qualification and a −40 °C to 125 °C operating range enable use in in-vehicle control and sensor interface electronics where reliability across temperature is required.
• Embedded processing and control — The combination of 16,000 logic elements and 562,176 RAM bits supports on-board protocol handling, control logic, and local data buffering for embedded systems.
• I/O aggregation and bridging — Up to 130 I/O pins and flexible 2.85 V–3.465 V supply support high-density signal aggregation, protocol conversion, and peripheral interfacing on compact PCBs.

Unique Advantages

• Automotive-grade reliability: AEC-Q100 qualification and a wide operating temperature range provide design confidence for vehicle electronics.
• High on-chip memory: 562,176 RAM bits reduce dependence on external memory, simplifying BOM and improving performance for buffering and data processing tasks.
• Substantial logic capacity: 16,000 logic elements enable implementation of complex control and interface logic in a single device.
• Large I/O complement: 130 I/O pins accommodate multiple peripherals and sensors without external expanders.
• Compact, surface-mount package: The 169-LFBGA (169-UBGA, 11×11) package supports space-constrained PCB layouts while maintaining robust soldered mounting.
• Regulatory and environmental readiness: RoHS compliance supports environmental manufacturing requirements.

Why Choose 10M16SCU169A7P?

The 10M16SCU169A7P delivers a balanced combination of logic density, on-chip RAM, and I/O capacity in an automotive-qualified FPGA package. Its AEC-Q100 rating and −40 °C to 125 °C operating range make it suitable for designs where temperature resilience and long-term reliability are priorities.

This device is a practical choice for engineers building embedded control, I/O aggregation, and automotive electronics that need integrated memory and significant programmable logic in a compact, surface-mount package. Its supply voltage range and RoHS compliance further simplify system-level integration and manufacturing readiness.

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