10M16SCE144C8G

The 10M16SCE144C8G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) in a 144-LQFP exposed pad surface-mount package. It provides 16,000 logic elements, 562,176 bits of on-chip RAM and up to 101 general-purpose I/Os, making it suitable for compact, commercial-grade FPGA designs.

Designed for commercial applications, this device operates from a 2.85 V to 3.465 V supply and within a 0 °C to 85 °C temperature range. It is RoHS-compliant and packaged for board-level surface-mount assembly.

Key Features

• Logic Capacity 16,000 logic elements to implement custom logic, state machines, and glue-logic functions.
• On-chip Memory 562,176 total RAM bits for data buffering, FIFOs, and small memory structures within designs.
• I/O Count Up to 101 I/Os to support a wide range of peripheral connections and parallel interfaces.
• Power Supply Operates from 2.85 V to 3.465 V supply voltage, compatible with common 3.3 V system domains.
• Package and Mounting 144-LQFP exposed pad (supplier package: 144-EQFP 20×20) in a surface-mount form factor for PCB integration.
• Operating Conditions Commercial-grade temperature range of 0 °C to 85 °C for standard commercial deployments.
• Regulatory RoHS-compliant for environmental compliance in commercial products.

Typical Applications

• FPGA-based custom logic Implement custom control logic and application-specific processing using up to 16,000 logic elements and on-chip RAM.
• Embedded I/O and interface control Use the 101 I/Os and available memory to manage multiple peripheral interfaces and glue-logic tasks in a 3.3 V system domain.
• Board-level integration Deploy the 144-LQFP exposed pad package where a surface-mount FPGA with an exposed pad footprint is required for PCB assembly.

Unique Advantages

• Balanced logic and memory Combines 16,000 logic elements with 562,176 RAM bits to support both control logic and local data storage without external memory in many use cases.
• High I/O density 101 I/Os offer flexibility for parallel interfaces, GPIO expansion, and mixed-peripheral designs.
• Commercial temperature rating Rated for 0 °C to 85 °C operation to meet standard commercial deployment requirements.
• Surface-mount, exposed-pad package 144-LQFP exposed pad (20×20 supplier designation) supports efficient board-level mounting and thermal conduction to the PCB land pattern.
• Wide supply voltage window 2.85 V to 3.465 V supply range aligns with common 3.3 V designs and allows straightforward power provisioning.
• RoHS-compliant Environmentally compliant for commercial product assemblies.

Why Choose 10M16SCE144C8G?

The 10M16SCE144C8G positions itself as a commercially graded Intel MAX® 10 FPGA option that delivers a practical balance of logic density, on-chip RAM, and I/O capacity in a solderable 144-LQFP exposed pad package. Its electrical and mechanical specifications—16,000 logic elements, 562,176 RAM bits, 101 I/Os, 2.85 V–3.465 V supply, and 0 °C–85 °C operating range—make it suitable for a wide range of commercial embedded designs that require integrated logic and memory.

Choose this device when you need a commercially rated FPGA from the MAX® 10 family with a compact surface-mount footprint, substantial on-chip memory, and a high I/O count for board-level integration.

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