10M16SAU324C8G

The 10M16SAU324C8G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) in a 324-LFBGA (324-UBGA, 15×15) package. It provides 16,000 logic elements, 562,176 bits of on-chip RAM and 246 I/O pins in a surface-mount commercial-grade device.

Designed for commercial embedded applications that require programmable logic, significant on-chip memory and a high I/O count, this device operates from a 1.15 V to 1.25 V supply and supports an operating temperature range of 0 °C to 85 °C. The part is RoHS compliant.

Key Features

• Core Logic  16,000 logic elements provide the programmable fabric for implementing custom logic, state machines and control functions.
• On-Chip Memory  562,176 total RAM bits enable local data buffering, FIFOs and small on-chip datasets without external memory.
• I/O Capacity  246 I/O pins support broad peripheral interfacing and parallel signal routing in compact system designs.
• Power  Specified core supply range of 1.15 V to 1.25 V for predictable power integration in regulated designs.
• Package and Mounting  324-LFBGA (324-UBGA 15×15) surface-mount package provides a high-density footprint for board-level integration.
• Commercial Grade & Temperature Range  Rated for commercial operation from 0 °C to 85 °C to meet standard ambient environment requirements.
• Regulatory  RoHS compliant for adherence to common materials restrictions in commercial electronics.

Typical Applications

• Commercial Embedded Systems  Implement custom control logic, peripheral aggregation and real-time data processing where on-chip memory and high I/O are required.
• Consumer Electronics  Enable feature-rich device control, custom interfaces and signal processing in compact, surface-mount form factors.
• Communications Equipment  Provide programmable data-path functions and I/O demarcation in network and connectivity hardware.

Unique Advantages

• Balanced Logic and Memory:  16,000 logic elements paired with 562,176 bits of RAM reduce dependence on external memory for many embedded functions.
• High I/O Density:  246 I/O pins allow extensive peripheral and bus interfacing from a single device, simplifying board-level routing.
• Compact, Surface-Mount Package:  324-LFBGA (15×15) delivers a high-density solution for space-constrained PCB layouts.
• Predictable Power Envelope:  Clear core voltage range (1.15 V–1.25 V) aids in power supply selection and system-level power planning.
• Commercial Ready:  Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream electronics deployments.

Why Choose 10M16SAU324C8G?

The 10M16SAU324C8G positions itself as a versatile commercial-grade FPGA that combines a substantial logic fabric, ample on-chip RAM and a large I/O complement in a compact 324-LFBGA package. It is well suited to designers and teams building commercial embedded systems, consumer devices and communications equipment that require programmable logic with integrated memory and extensive interfacing.

By offering a defined supply voltage window and standard commercial temperature rating along with RoHS compliance, this device supports straightforward integration into regulated production designs while reducing system BOM complexity.

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