10M16SAU169A7G

The 10M16SAU169A7G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) supplied in a 169‑LFBGA package. It provides 16,000 logic elements and 562,176 bits of on‑device RAM, with 130 I/O pins for configurable digital interfacing.

Designed and qualified for automotive use, this device supports a 2.85 V to 3.465 V supply range and operates from −40 °C to 125 °C, making it suitable for embedded automotive applications that require on‑chip logic and memory in a compact surface‑mount package.

Key Features

• Core Logic  16,000 logic elements provide flexible programmable logic capacity for custom digital functions and control logic.
• Embedded Memory  562,176 bits of total on‑device RAM for buffering, FIFOs, and local storage without mandatory external memory.
• I/O Resources  130 programmable I/O pins support broad interfacing options to sensors, actuators, and other system peripherals.
• Automotive Qualification  Automotive grade device with AEC‑Q100 qualification for applications that require automotive qualification status.
• Power and Temperature  Supported supply voltage range from 2.85 V to 3.465 V and an operating temperature range of −40 °C to 125 °C for heated environments.
• Package and Mounting  169‑LFBGA (supplier device package: 169‑UBGA 11 × 11) surface‑mount package for compact board footprints.
• RoHS Compliant  Device is RoHS compliant for environmental and regulatory considerations.

Typical Applications

• Automotive Electronic Control  Engine, body, or chassis control subsystems that require AEC‑Q100 qualified programmable logic and wide operating temperature support.
• In‑vehicle I/O Aggregation  Consolidating and interfacing multiple sensor and actuator signals using the device’s 130 I/O pins and on‑device RAM for buffering.
• Embedded Control and Signal Processing  Onboard logic and memory for custom control algorithms and deterministic processing in automotive embedded systems.

Unique Advantages

• Automotive‑grade Qualification: AEC‑Q100 qualification and automotive grade designation provide traceable suitability for vehicle electronics.
• Integrated Memory & Logic: 16,000 logic elements combined with 562,176 bits of RAM reduce dependence on external memory and simplify BOM.
• Generous I/O Count: 130 I/O pins enable flexible system partitioning and direct connectivity to peripherals and sensors.
• Wide Temperature & Voltage Range: Rated operation from −40 °C to 125 °C and a 2.85 V–3.465 V supply range accommodate typical automotive power and environment conditions.
• Compact Surface‑Mount Package: 169‑LFBGA / 169‑UBGA (11 × 11) package minimizes PCB area while supporting surface‑mount assembly processes.
• Regulatory Compliance: RoHS compliance aligns with environmental and manufacturing requirements.

Why Choose 10M16SAU169A7G?

The 10M16SAU169A7G offers a balance of programmable logic capacity, on‑device RAM, and a high I/O count in a compact 169‑LFBGA package. Its AEC‑Q100 qualification, automotive grade designation, and extended operating temperature and voltage ranges position it for embedded automotive designs that require configurable logic and local memory.

For designs that need integrated logic, memory, and flexible I/O in a qualified automotive package, this MAX® 10 FPGA provides a verifiable, specification‑driven option that supports deployment in temperature‑stressed vehicle environments.

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