10M16DCU324I6G

The 10M16DCU324I6G is an Intel MAX® 10 field programmable gate array (FPGA) provided in a 324-ball LFBGA package. It delivers 16,000 logic elements, on-chip RAM totaling 562,176 bits, and up to 246 general-purpose I/O channels in a surface-mount package optimized for space-constrained industrial applications.

Designed as an industrial-grade device (‑I6 speed grade), this FPGA supports operation from ‑40 °C to 100 °C and a core supply range of 1.15 V to 1.25 V, making it suitable for systems that require sustained operation across wide temperature and voltage conditions.

Key Features

• Core Density 16,000 logic elements for implementing custom logic, state machines, and glue-logic functions.
• On‑Chip Memory 562,176 bits of total RAM for buffering, FIFOs, and small data storage without external memory.
• I/O Capacity Up to 246 I/O pins to support multiple parallel interfaces, signal routing, and peripheral connectivity.
• Industrial Grade & Speed Device marked as industrial grade with an I6 speed grade as specified in the product data.
• Power Supply Core voltage supply range of 1.15 V to 1.25 V to match typical low-voltage FPGA power domains.
• Package & Mounting 324‑LFBGA package (also listed as 324‑UBGA, 15×15) in a surface-mount form factor for compact PCB designs.
• Operating Temperature Rated for operation from ‑40 °C to 100 °C for demanding ambient environments.
• Compliance RoHS‑compliant for environmental and manufacturing consistency.

Typical Applications

• Industrial control systems — Suited for control logic and I/O aggregation in equipment that requires industrial temperature operation and robust on‑chip memory.
• I/O‑dense interfaces — High pin count supports boards that consolidate multiple parallel signals or sensor arrays.
• Embedded buffering and logic — Significant on‑chip RAM and 16k logic elements enable localized data buffering, protocol handling, and custom logic without immediate external memory.
• Compact system modules — Surface-mount 324‑ball LFBGA/UBGA package fits space-constrained designs needing a high integration level.

Unique Advantages

• Balanced logic and memory resources — 16,000 logic elements combined with 562,176 RAM bits provide flexibility to implement both control logic and data buffering on the same device.
• High I/O count — 246 I/Os reduce the need for external multiplexers or GPIO expanders when interfacing multiple peripherals or parallel data buses.
• Industrial temperature capability — Rated from ‑40 °C to 100 °C to support deployment in harsh or wide‑range thermal environments.
• Compact, surface‑mount package — 324‑ball LFBGA/UBGA (15×15) supports high-density PCB layouts while maintaining manufacturability with surface-mount assembly processes.
• Low-voltage core operation — 1.15 V to 1.25 V core supply range compatible with low-voltage system domains and modern power architectures.
• RoHS compliant — Meets common environmental and manufacturing requirements for lead‑free production.

Why Choose 10M16DCU324I6G?

The 10M16DCU324I6G positions itself as a compact, industrial‑grade FPGA option that combines a substantial logic fabric (16k logic elements) with a large on‑chip RAM pool and a high I/O count. Its surface‑mount 324‑ball package and industrial temperature rating make it appropriate for embedded and industrial applications where board space, thermal range, and integration matter.

Choose this device when your design requires on‑chip memory for buffering, numerous I/O lines for peripheral interfacing, and the ability to run reliably across a wide temperature and specified voltage range. The device provides a straightforward platform for consolidating logic functions and minimizing external components.

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