10M16DCU324I7G

The 10M16DCU324I7G is an Intel MAX® 10 field-programmable gate array (FPGA) in a 324-LFBGA (324-UBGA, 15×15) package. It provides a balanced combination of programmable logic, on-chip RAM, and a high I/O count for designs that require user-configurable digital logic and memory resources.

With 16,000 logic elements, 562,176 total RAM bits, and up to 246 I/Os, this industrial-grade device targets embedded and system designs that need compact, surface-mount FPGA integration while operating across a broad industrial temperature range.

Key Features

• Logic Capacity  16,000 logic elements to implement custom logic, state machines, and data-path functions.
• On-Chip Memory  562,176 total RAM bits for buffering, FIFOs, and small on-chip data storage to reduce external memory requirements.
• I/O Density  246 I/O pins to support high-pin-count interfaces and multiple peripheral connections directly from the FPGA.
• Core Voltage  Nominal supply requirement between 1.15 V and 1.25 V for core power planning and regulator selection.
• Industrial Grade and Speed  Specified as Industrial grade with a -I7 speed grade indicated in product identification and supported device grade listings.
• Package and Mounting  324-LFBGA (supplier package: 324-UBGA, 15×15) surface-mount package for compact board implementations.
• Operating Temperature  Rated for -40 °C to 100 °C to meet a wide range of industrial operating environments.
• RoHS Compliant  Manufactured in compliance with RoHS requirements.

Typical Applications

• Custom Logic and Glue Logic  Implement protocol conversion, timing adaptation, and glue logic using the device’s 16,000 logic elements and abundant I/O.
• On-Board Data Handling  Use the 562,176 bits of on-chip RAM for buffering, FIFOs, and temporary storage to reduce external memory dependencies.
• I/O Aggregation and Interface Bridging  246 I/Os enable aggregation of multiple peripheral interfaces and signal routing within a single FPGA package.
• Industrial Embedded Systems  Industrial temperature rating (-40 °C to 100 °C) and surface-mount 324-LFBGA packaging suit compact, board-level embedded designs.

Unique Advantages

• Balanced Logic-to-Memory Ratio:  16,000 logic elements paired with 562,176 RAM bits provides resources for mixed control and data-buffering tasks without excessive external components.
• High I/O Count:  246 available I/Os simplify integration with multiple sensors, peripherals, or interface buses while keeping a single FPGA solution.
• Industrial Temperature Range:  Rated from -40 °C to 100 °C for deployment in temperature-challenging environments.
• Compact Surface-Mount Package:  324-LFBGA (324-UBGA, 15×15) enables space-efficient PCB designs with a robust BGA footprint.
• Low-Voltage Core:  1.15 V to 1.25 V core supply requirement aligns with modern power-rail planning for efficient power delivery.
• Regulatory Compliance:  RoHS compliance reduces concerns around hazardous substances in manufacturing and assembly.

Why Choose 10M16DCU324I7G?

The 10M16DCU324I7G combines a practical logic capacity with substantial on-chip RAM and a high I/O count in a compact 324-LFBGA surface-mount package. Its industrial temperature rating and Intel MAX® 10 family designation make it a suitable choice for engineers seeking a programmable device that consolidates logic, memory, and I/O in a single component.

This part is well suited to designers who need predictable core voltage planning, reduced external memory needs, and flexible I/O routing while maintaining a compact board footprint and RoHS compliance.

Request a quote or submit a purchase inquiry today to evaluate the 10M16DCU324I7G for your next design project.