10M16DCU324A7G

The 10M16DCU324A7G is a MAX® 10 Field Programmable Gate Array (FPGA) offering 16,000 logic elements and 562,176 total RAM bits in a 324-ball LFBGA package. It provides up to 246 user I/Os and is supplied for use at core voltages between 1.15 V and 1.25 V.

This device is qualified to AEC‑Q100 and graded for automotive use, and is specified for operation from -40°C to 125°C, making it suitable for designs that require automotive qualification, elevated temperature tolerance, and high I/O density in a surface‑mount BGA footprint.

Key Features

• Core Logic  16,000 logic elements provide the programmable fabric for custom digital functions, signal processing, and control logic.
• Configurable Logic Blocks  1,000 CLBs (as reported) for structured implementation of combinational and sequential logic.
• On‑Chip Memory  562,176 total RAM bits for embedded data buffering, state storage, and small embedded memory structures.
• I/O Capacity  Up to 246 user I/Os to support multiple parallel interfaces, sensor connections, and GPIO expansion.
• Power  Core supply range of 1.15 V to 1.25 V to match system power rails and power-management strategies.
• Package and Mounting  324-LFBGA / 324-UBGA (15×15) surface-mount package for compact board integration and high pin density.
• Automotive Qualification  AEC‑Q100 qualification and an Automotive grade designation for designs requiring automotive component qualification.
• Temperature Range  Rated for operation from -40°C to 125°C to support temperature-demanding environments.
• Regulatory Status  RoHS‑compliant construction for regulatory and environmental adherence.

Typical Applications

• Automotive control modules  Use the device's AEC‑Q100 qualification, operating temperature range, and high I/O count to implement vehicle control and monitoring logic.
• In-vehicle I/O aggregation  Consolidate multiple sensor and actuator interfaces using up to 246 I/Os and programmable logic to reduce system complexity.
• Embedded system prototyping for automotive designs  Leverage 16,000 logic elements and substantial on-chip RAM for early development and validation of automotive digital functions.

Unique Advantages

• Automotive-qualified platform: AEC‑Q100 qualification and Automotive grade designation provide a clear path for designs that require automotive-rated components.
• High logic and memory density: 16,000 logic elements paired with 562,176 RAM bits enable integration of complex control and buffering functions on a single device.
• Extensive I/O capability: 246 user I/Os support broad interfacing, minimizing the need for external multiplexers or IO expanders.
• Compact, high‑pin package: 324-LFBGA/324-UBGA (15×15) offers high pin count in a compact footprint for space-constrained PCBs.
• Wide operating temperature: Rated from -40°C to 125°C to address designs exposed to wide thermal ranges.
• RoHS compliant: Environmentally compliant construction simplifies regulatory management for production designs.

Why Choose 10M16DCU324A7G?

The 10M16DCU324A7G positions itself as a qualified, compact FPGA option for automotive-focused designs that require a balance of logic capacity, on-chip memory, and a large I/O complement. Its AEC‑Q100 qualification and -40°C to 125°C rating make it suitable where component qualification and thermal robustness are necessary.

Designers targeting automotive control, I/O aggregation, or embedded prototyping can leverage the device’s integration to reduce board-level complexity while maintaining a high-density, surface-mount package. The combination of logic elements, RAM, and I/O capacity supports scalable designs and faster integration into automotive development workflows.

Request a quote or submit an inquiry to receive pricing and availability information for the 10M16DCU324A7G and discuss how it fits your next automotive or temperature‑sensitive FPGA design.