10M16DCF484C7G

The 10M16DCF484C7G is an Intel MAX® 10 field-programmable gate array offered in a 484-ball FBGA package. It provides a mid-range combination of programmable logic, on-chip RAM, and high I/O density suitable for commercial embedded and system-design applications.

With 16,000 logic elements, 562,176 bits of RAM and up to 320 user I/Os, this device is targeted at designs that require a balance of logic capacity, memory resources, and interface flexibility while operating from a 1.15–1.25 V supply and a 0 °C to 85 °C commercial temperature range.

Key Features

• Core Logic — 16,000 logic elements for implementing combinational and sequential logic, state machines, and custom IP.
• On‑Chip Memory — 562,176 total RAM bits to support buffering, packet processing, and local data storage without external memory.
• I/O Density — Up to 320 user I/Os to accommodate wide parallel interfaces, multiple serial links, or mixed-signal front ends.
• Power and Supply — Operates from a 1.15 V to 1.25 V core supply, enabling consistency with MAX 10 family power domains.
• Package and Mounting — 484-FBGA (23 × 23) package, surface-mount mounting type for compact board layouts and high pin-count applications.
• Commercial Grade and Temperature — Rated for commercial operation from 0 °C to 85 °C; Grade: Commercial.
• Environmental Compliance — RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

• Commercial Embedded Systems — Implement control logic, protocol handling, and peripheral aggregation in compact, board-level designs operating within commercial temperature ranges.
• Interface Bridging — Use the high I/O count to bridge between parallel buses, GPIO collections, and custom interface standards.
• Data Buffering and Pre‑Processing — Leverage the 562,176 bits of on-chip RAM for packet buffering, look-up tables, and intermediate data manipulation without external memory.
• Prototyping and System Integration — Apply the programmable logic capacity to evaluate custom accelerators, state machines, or peripheral controllers in development platforms.

Unique Advantages

• Balanced Logic and Memory: 16,000 logic elements combined with over half a million RAM bits enables diverse functions on a single device, reducing the need for external components.
• High I/O Count: 320 I/Os support complex interfacing and multiple peripheral connections without sacrificing board real estate.
• Compact BGA Package: 484-FBGA (23×23) delivers high pin density in a compact footprint for space-constrained designs.
• Commercial Temperature Rating: 0 °C to 85 °C operation aligns with mainstream commercial electronics and embedded applications.
• Surface-Mount Ready: Surface-mount package and RoHS compliance facilitate standard PCB assembly and regulatory requirements.

Why Choose 10M16DCF484C7G?

The 10M16DCF484C7G positions itself as a flexible, mid-range FPGA option within the MAX® 10 family, offering a practical mix of logic capacity, embedded RAM, and I/O density for commercial embedded designs. Its 484-FBGA package and surface-mount form factor make it suitable for compact system boards where multiple interfaces and on-chip memory are required.

This device is well suited to development teams and product designers seeking a single-device solution to consolidate logic, buffering, and interfacing tasks while maintaining a commercial operating profile and RoHS compliance.

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