10M16DCF484C8G

IC FPGA 320 I/O 484FBGA
Part Description

MAX® 10 Field Programmable Gate Array (FPGA) IC 320 562176 16000 484-BGA

Quantity 15 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O320Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1000Number of Logic Elements/Cells16000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits562176

Overview of 10M16DCF484C8G – MAX® 10 Field Programmable Gate Array (FPGA) IC 320 562176 16000 484-BGA

The 10M16DCF484C8G is an Intel MAX 10 field programmable gate array (FPGA) delivered in a 484-BGA surface-mount package. It provides a programmable logic platform with 16,000 logic elements, 562,176 total RAM bits, and 320 user I/O pins for commercial-grade embedded designs.

Designed for commercial-temperature applications, this device operates from a 1.15 V to 1.25 V supply and is qualified for 0 °C to 85 °C operation. The 484-FBGA (23×23) package and RoHS compliance support modern PCB assembly and environmental requirements.

Key Features

  • Core Capacity — 16,000 logic elements provide the programmable fabric for implementing custom digital logic and control functions.
  • Embedded Memory — 562,176 total RAM bits for on-chip data buffering, state storage, and memory-mapped logic.
  • GPIO and Connectivity — 320 user I/O pins to support multiple interfaces, parallel buses, and high pin-count connectivity.
  • Power — Operates from a 1.15 V to 1.25 V supply range to match platform power rails and system designs.
  • Package and Mounting — 484-BGA (supplier package: 484-FBGA, 23×23) in a surface-mount package for compact board-level integration.
  • Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C for standard industrial and consumer applications.
  • Compliance — RoHS compliant to support regulatory and environmental requirements.

Unique Advantages

  • High integration density: 16,000 logic elements combined with 562,176 RAM bits enable substantial on-chip functionality and reduce reliance on external logic and memory.
  • Generous I/O count: 320 I/O pins provide flexibility to connect multiple peripherals, sensors, or parallel interfaces without extensive board-level multiplexing.
  • Compact, assembly-friendly package: 484-FBGA (23×23) surface-mount package supports high-density PCB layouts while maintaining robust soldering compatibility.
  • Commercial temperature support: Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial and general-purpose embedded systems.
  • Regulatory alignment: RoHS compliance facilitates use in designs requiring lead-free and environmentally conscious components.

Why Choose 10M16DCF484C8G?

The 10M16DCF484C8G balances programmable logic capacity, embedded memory, and extensive I/O in a single commercial-grade FPGA package. Its combination of 16,000 logic elements and over half a million RAM bits supports medium-complexity digital designs that require on-chip memory and plentiful external connectivity.

This device is well suited to engineers and procurement teams looking for a programmable, RoHS-compliant FPGA solution that fits standard 23×23 484-BGA board layouts and operates from common low-voltage rails. The specification set supports scalable deployments where integration density, I/O flexibility, and commercial-temperature operation are key selection criteria.

Request a quote or submit an inquiry to get pricing and availability for the 10M16DCF484C8G. Our team will respond with detailed ordering and lead-time information to support your project timeline.

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