10M16DCF484C8G
| Part Description |
MAX® 10 Field Programmable Gate Array (FPGA) IC 320 562176 16000 484-BGA |
|---|---|
| Quantity | 15 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 320 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1000 | Number of Logic Elements/Cells | 16000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 562176 |
Overview of 10M16DCF484C8G – MAX® 10 Field Programmable Gate Array (FPGA) IC 320 562176 16000 484-BGA
The 10M16DCF484C8G is an Intel MAX 10 field programmable gate array (FPGA) delivered in a 484-BGA surface-mount package. It provides a programmable logic platform with 16,000 logic elements, 562,176 total RAM bits, and 320 user I/O pins for commercial-grade embedded designs.
Designed for commercial-temperature applications, this device operates from a 1.15 V to 1.25 V supply and is qualified for 0 °C to 85 °C operation. The 484-FBGA (23×23) package and RoHS compliance support modern PCB assembly and environmental requirements.
Key Features
- Core Capacity — 16,000 logic elements provide the programmable fabric for implementing custom digital logic and control functions.
- Embedded Memory — 562,176 total RAM bits for on-chip data buffering, state storage, and memory-mapped logic.
- GPIO and Connectivity — 320 user I/O pins to support multiple interfaces, parallel buses, and high pin-count connectivity.
- Power — Operates from a 1.15 V to 1.25 V supply range to match platform power rails and system designs.
- Package and Mounting — 484-BGA (supplier package: 484-FBGA, 23×23) in a surface-mount package for compact board-level integration.
- Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C for standard industrial and consumer applications.
- Compliance — RoHS compliant to support regulatory and environmental requirements.
Unique Advantages
- High integration density: 16,000 logic elements combined with 562,176 RAM bits enable substantial on-chip functionality and reduce reliance on external logic and memory.
- Generous I/O count: 320 I/O pins provide flexibility to connect multiple peripherals, sensors, or parallel interfaces without extensive board-level multiplexing.
- Compact, assembly-friendly package: 484-FBGA (23×23) surface-mount package supports high-density PCB layouts while maintaining robust soldering compatibility.
- Commercial temperature support: Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial and general-purpose embedded systems.
- Regulatory alignment: RoHS compliance facilitates use in designs requiring lead-free and environmentally conscious components.
Why Choose 10M16DCF484C8G?
The 10M16DCF484C8G balances programmable logic capacity, embedded memory, and extensive I/O in a single commercial-grade FPGA package. Its combination of 16,000 logic elements and over half a million RAM bits supports medium-complexity digital designs that require on-chip memory and plentiful external connectivity.
This device is well suited to engineers and procurement teams looking for a programmable, RoHS-compliant FPGA solution that fits standard 23×23 484-BGA board layouts and operates from common low-voltage rails. The specification set supports scalable deployments where integration density, I/O flexibility, and commercial-temperature operation are key selection criteria.
Request a quote or submit an inquiry to get pricing and availability for the 10M16DCF484C8G. Our team will respond with detailed ordering and lead-time information to support your project timeline.

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