10M16DCU324C8G

The 10M16DCU324C8G is a MAX® 10 Field Programmable Gate Array (FPGA) IC from Intel, provided in a 324-LFBGA (324-UBGA 15×15) surface-mount package. It combines 16,000 logic elements with 562,176 bits of on-chip RAM and up to 246 I/Os, making it suitable for designs that require moderate logic capacity and significant I/O connectivity.

Designed for commercial-grade applications, the device operates from a 1.15 V to 1.25 V supply and supports an operating temperature range of 0 °C to 85 °C. The component is RoHS compliant.

Key Features

• Core & Logic — 16,000 logic elements (LEs) to implement custom combinational and sequential logic functions.
• On‑Chip Memory — 562,176 total RAM bits for embedded buffers, LUT-based memory, and data storage.
• I/O Capacity — 246 I/O pins to support multiple interfaces, parallel buses, and external device connections.
• Power — Voltage supply range of 1.15 V to 1.25 V for core operation.
• Package & Mounting — 324-LFBGA (supplier package: 324-UBGA, 15×15) in a surface-mount form factor for compact board layouts.
• Temperature & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental — RoHS compliant.

Typical Applications

• Custom logic implementation — Implement medium-scale custom logic and control functions using 16,000 logic elements and embedded RAM.
• I/O‑intensive interfaces — Bridge and manage multiple external interfaces and parallel buses with 246 available I/Os.
• Data buffering and on-chip storage — Use 562,176 bits of RAM for temporary storage, FIFO buffers, or packet processing tasks.

Unique Advantages

• Balanced logic and memory capacity: 16,000 logic elements paired with 562,176 RAM bits provide a versatile resource mix for control, data-path, and buffering tasks.
• High I/O count: 246 I/Os enable flexible connectivity to sensors, peripherals, and external logic without immediate need for expansion components.
• Compact BGA footprint: 324-LFBGA (324-UBGA 15×15) surface-mount package supports dense PCB designs while maintaining manufacturability.
• Commercial temperature rating: Specified 0 °C to 85 °C operation aligns with a wide range of commercial electronic systems.
• Regulatory compliance: RoHS compliance helps meet environmental and manufacturing requirements.

Why Choose 10M16DCU324C8G?

The 10M16DCU324C8G offers a practical combination of logic density, embedded RAM, and I/O count in a compact BGA package, making it a strong choice for commercial designs that require moderate FPGA resources and substantial connectivity. Its supply voltage and operating temperature range are specified for standard commercial environments, and RoHS compliance supports contemporary manufacturing practices.

This device is well suited for engineers developing custom control logic, interface bridges, or data buffering solutions who need a balanced, board-level FPGA option with verified on-chip memory and a high pin count.

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