10M16SAE144C8G

The 10M16SAE144C8G is an Intel MAX® 10 field programmable gate array (FPGA) IC designed for commercial electronic designs that require configurable logic. It provides up to 16,000 logic elements with 562,176 bits of on-chip RAM and 101 I/O pins in a 144‑LQFP exposed pad package.

With a supply voltage range of 2.85 V to 3.465 V and an operating temperature range of 0 °C to 85 °C, this surface‑mount FPGA supports a range of standard commercial applications requiring flexible, reprogrammable logic and moderate on‑chip memory capacity.

Key Features

• Core Logic — 16,000 logic elements provide flexible programmable resources for custom digital functions and control logic.
• On‑Chip Memory — 562,176 total RAM bits available for buffers, FIFOs, and temporary data storage within the FPGA fabric.
• I/O Capacity — 101 general‑purpose I/O pins to interface with peripherals, sensors, and external devices.
• Power — Operates from a 2.85 V to 3.465 V supply, accommodating common commercial voltage domains.
• Package & Mounting — 144‑LQFP with exposed pad (supplier device package: 144‑EQFP, 20 × 20), designed for surface‑mount assembly.
• Commercial Temperature Range — Rated for operation from 0 °C to 85 °C, suitable for standard commercial environments.
• RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

• Embedded Systems — Use the FPGA’s 16,000 logic elements and on‑chip RAM to implement custom control, data processing, and peripheral glue logic in commercial embedded products.
• Prototyping and Development — Reprogrammable fabric and plentiful I/O make the device suitable for hardware prototyping and iterative design validation.
• Interface Aggregation — 101 I/O pins enable consolidation of multiple peripheral interfaces and signal routing in compact, surface‑mount designs.

Unique Advantages

• Balanced Logic and Memory: Combines 16,000 logic elements with 562,176 bits of RAM to support both complex state machine logic and on‑chip data buffering.
• Generous I/O Count: 101 I/O pins provide flexibility for connecting sensors, controllers, and communication interfaces without external glue logic.
• Surface‑Mount Friendly Package: 144‑LQFP exposed pad packaging (20 × 20 EQFP footprint) simplifies PCB layout and thermal management for commercial assemblies.
• Commercial‑Grade Voltage and Temperature: Operates across a 2.85 V–3.465 V supply range and 0 °C–85 °C, matching common commercial system requirements.
• Environmentally Compliant: RoHS compliance supports regulatory and manufacturing needs for lead‑free assemblies.

Why Choose 10M16SAE144C8G?

The 10M16SAE144C8G positions itself as a practical choice for commercial FPGA designs that need a balanced mix of logic density, on‑chip memory, and I/O capacity in a compact surface‑mount package. Its specification set supports configurable system functions, interface consolidation, and iterative development workflows.

Designed for teams and products targeting commercial operating conditions, the device offers predictable electrical and thermal characteristics along with RoHS compliance, helping simplify procurement and BOM decisions while providing reprogrammable flexibility for evolving design requirements.

Request a quote or submit an inquiry to obtain pricing and availability for the 10M16SAE144C8G and evaluate how it fits into your next commercial FPGA design.