10M16SAE144I7G

The 10M16SAE144I7G is an Intel MAX® 10 FPGA packaged in a 144-LQFP exposed pad surface-mount package. It delivers up to 16,000 logic elements with 562,176 bits of on-chip RAM and a 101-pin I/O count, making it suitable for space-constrained, I/O-rich embedded designs.

Designed and specified for industrial use, this device supports an operating temperature range of -40 °C to 100 °C and a supply-voltage window of 2.85 V to 3.465 V. Detailed electrical and timing characteristics are documented in the Intel MAX 10 FPGA device datasheet.

Key Features

• Core Capacity  Up to 16,000 logic elements for implementing programmable logic, custom glue logic, and finite-state machines.
• On-Chip Memory  562,176 total RAM bits to support deep buffering, lookup tables, and embedded data structures.
• I/O Density  101 available I/O pins to interface with sensors, controllers, and peripheral devices.
• Power  Operates from a 2.85 V to 3.465 V supply range suitable for common 3.3 V systems.
• Package & Mounting  144-LQFP exposed pad (supplier device package: 144-EQFP 20×20) in a surface-mount form factor for compact PCB implementations and thermal grounding.
• Temperature Range  Industrial grade operation from -40 °C to 100 °C for deployment in harsh or temperature-variable environments.
• Standards & Compliance  RoHS-compliant as supplied.

Typical Applications

• Industrial Control  Use the device’s industrial temperature rating and abundant logic elements for sensor aggregation, deterministic control logic, and custom I/O handling in factory automation and process control equipment.
• Embedded System Integration  Leverage the combination of on-chip RAM and 101 I/O pins to consolidate interface logic, reduce external components, and implement protocol bridging in embedded products.
• Human–Machine Interfaces (HMI)  Implement display controllers, input scanning, and peripheral multiplexing using the device’s logic density and flexible I/O mix in control panels and operator stations.
• Prototyping & Proof-of-Concept  Employ the MAX® 10 device for early hardware validation when a compact, surface-mount FPGA with significant logic and memory resources is required.

Unique Advantages

• High Logic Density:  16,000 logic elements provide ample capacity for medium-complexity designs while keeping board area minimal.
• Substantial On-Chip RAM:  562,176 RAM bits enable local buffering and table storage without relying solely on external memory.
• Broad I/O Count:  101 I/O pins allow direct connection to multiple peripherals and parallel interfaces, reducing the need for external I/O expanders.
• Industrial Temperature Reliability:  Rated for -40 °C to 100 °C operation, supporting deployment in temperature-challenged environments.
• Compact, Thermally Aware Package:  The 144-LQFP exposed pad package supports surface-mount assembly and thermal management through the exposed pad.
• RoHS Compliance:  Manufactured to RoHS standards to meet environmental and regulatory requirements for lead-free assembly.

Why Choose 10M16SAE144I7G?

The 10M16SAE144I7G positions itself as a compact, industrial-grade FPGA option within the Intel MAX® 10 family, offering a balanced combination of logic capacity, on-chip RAM, and ample I/O in a surface-mount 144-LQFP exposed pad package. Its electrical and timing behavior are documented in the Intel MAX 10 FPGA device datasheet, and the family supports industrial speed grades.

This device is well suited to engineers and procurement teams seeking a programmable logic device for industrial embedded applications that demand moderate logic density, significant local memory, and a high I/O count in a small PCB footprint.

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