10M16SAU169I7G

The 10M16SAU169I7G is an Intel MAX® 10 field programmable gate array (FPGA) supplied in a 169‑LFBGA package. This industrial‑grade FPGA delivers 16,000 logic elements, 562,176 bits of on‑chip RAM and up to 130 programmable I/O pins for mid‑density programmable logic requirements.

Designed for surface‑mount assembly and operation across an industrial temperature range, the device targets designs that require on‑chip memory, flexible I/O count and a compact BGA footprint while operating from a 2.85 V to 3.465 V supply.

Key Features

• Logic Capacity — 16,000 logic elements suitable for mid‑density FPGA designs requiring programmable logic resources.
• On‑Chip Memory — 562,176 total RAM bits for embedded buffering, state storage and small data structures without external memory.
• I/O Resources — Up to 130 programmable I/O pins to support multiple peripherals, interfaces and GPIO requirements.
• Package & Mounting — 169‑LFBGA (supplier package: 169‑UBGA, 11×11) delivered in a surface‑mount form factor for compact board integration.
• Voltage Supply — Operates from 2.85 V to 3.465 V to match common board power rails.
• Temperature Rating — Industrial grade with an operating temperature range of -40 °C to 100 °C for deployment in harsher environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• I/O‑centric control — Use the 130 I/O pins to interface with sensors, actuators and peripheral ICs in control and automation designs that need programmable logic.
• On‑chip buffering and data handling — Leverage 562,176 bits of RAM for local buffering, packet handling or temporary data storage without immediate external memory.
• Mid‑density logic integration — Implement custom glue logic, protocol translation or feature‑level hardware acceleration within the 16,000 logic element capacity.

Unique Advantages

• Balanced logic and memory — The combination of 16,000 logic elements and 562,176 RAM bits supports designs that require both programmable logic and meaningful on‑chip storage.
• High I/O count — Up to 130 I/O pins give flexibility to connect multiple interfaces and peripherals without immediate external expanders.
• Industrial temperature range — Rated for -40 °C to 100 °C, suitable for applications that must operate reliably across extended temperature conditions.
• Compact BGA packaging — 169‑LFBGA (11×11 UBGA footprint) enables space‑efficient PCB layouts for dense embedded systems.
• RoHS compliant — Complies with RoHS environmental requirements for regulatory and manufacturing needs.
• Standard supply voltage — Supports a common 2.85 V to 3.465 V supply range for straightforward power subsystem integration.

Why Choose 10M16SAU169I7G?

The 10M16SAU169I7G positions itself as a mid‑density, industrial‑grade FPGA that pairs substantial on‑chip RAM with a meaningful logic element budget and a high I/O count. Its BGA package and surface‑mount form factor make it suitable for compact, rugged designs where on‑chip memory and flexible I/O are required.

This device is appropriate for engineers building systems that need integrated RAM, programmable logic resources and robust thermal performance, offering straightforward power requirements and RoHS compliance for long‑term production use.

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