10M16SAU324I7G

The 10M16SAU324I7G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) provided in a 324-LFBGA package. It delivers a mid-range logic capacity with 16,000 logic elements and on-chip RAM totaling 562,176 bits, making it suitable for designs that need a balance of density and memory on a single device.

With 246 general-purpose I/O pins, a 2.85 V to 3.465 V supply range, and an industrial operating temperature rating of −40 °C to 100 °C, this device targets industrial and embedded applications that require robust I/O count, retained memory resources, and extended temperature operation.

Key Features

• Core Logic 16,000 logic elements provide a mid-range programmable fabric for implementing custom logic, control functions, and glue logic.
• On-Chip Memory 562,176 total RAM bits available for data buffering, FIFOs, and intermediate storage to support signal processing and control tasks.
• I/O Density 246 I/O pins to support multiple parallel interfaces, sensor arrays, and dense connectivity without external multiplexing.
• Package and Mounting Supplied in a 324-LFBGA package suitable for surface-mount assembly in compact board designs.
• Power Supply Operates from a 2.85 V to 3.465 V supply range, enabling compatibility with common system power rails.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet deployment requirements in harsh or temperature-variable environments.
• Regulatory Compliance RoHS compliant, supporting lead-free manufacturing and standard environmental directives.

Typical Applications

• Industrial Automation — Use the 246 I/Os and industrial temperature rating for PLC I/O modules, motion control interfaces, and discrete I/O expansion.
• Embedded Control Systems — 16,000 logic elements and substantial on-chip RAM enable custom control logic, protocol handling, and real-time decision functions.
• Communications and I/O Bridging — High I/O count and internal RAM are useful for interface bridging, parallel-to-serial conversion, and protocol translation in communication equipment.

Unique Advantages

• Balanced Logic and Memory: 16,000 logic elements paired with 562,176 RAM bits deliver programmable capacity for both control logic and local data buffering.
• High I/O Count: 246 I/Os reduce the need for external multiplexers or additional interface ICs, simplifying board design and lowering BOM.
• Industrial Reliability: An operating range of −40 °C to 100 °C targets deployments where temperature resilience is required.
• Flexible Power Range: Support for 2.85 V to 3.465 V supplies allows integration into a variety of system power architectures.
• Compact Surface-Mount Package: The 324-LFBGA package enables dense layout and space-efficient PCB implementations.

Why Choose 10M16SAU324I7G?

The 10M16SAU324I7G is positioned as a mid-range MAX® 10 FPGA option for engineers who need a practical mix of logic resources, on-chip memory, and extensive I/O in an industrial-capable package. Its combination of 16,000 logic elements, over half a million bits of RAM, and 246 I/Os makes it well suited to embedded control, I/O-dense interfaces, and industrial automation tasks.

Manufactured by Intel and provided in a 324-LFBGA surface-mount package, this device offers a compact, robust building block for designs that require reliable operation across extended temperature ranges and compatibility with standard 3.3 V-class power rails.

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