10M16DCF484I6G

IC FPGA 320 I/O 484FBGA
Part Description

MAX® 10 Field Programmable Gate Array (FPGA) IC 320 562176 16000 484-BGA

Quantity 1,263 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGANumber of I/O320Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1000Number of Logic Elements/Cells16000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits562176

Overview of 10M16DCF484I6G – MAX® 10 FPGA, 16,000 Logic Elements, 484‑BGA

The 10M16DCF484I6G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) provided in a 484‑ball fine‑pitch BGA (484‑FBGA, 23×23 mm) package. It delivers a balance of programmable logic, on‑chip RAM, and a large number of user I/O for industrial embedded designs that require compact, surface‑mount FPGA integration.

Designed for industrial-grade operation, this device supports a core supply voltage range of 1.15 V to 1.25 V and an operating temperature range from -40°C to 100°C, and is RoHS compliant.

Key Features

  • Core Logic  16,000 logic elements providing the programmable fabric for implementing custom logic functions and control paths.
  • On‑chip Memory  562,176 total RAM bits for embedded data buffering, state machines, and local storage.
  • I/O Density  320 user I/O pins to interface with multiple peripherals, sensors, and external devices.
  • Package & Mounting  484‑FBGA supplier package (23×23 mm) in a surface‑mount form factor for high‑density board designs.
  • Power  Core voltage support from 1.15 V to 1.25 V to match system power-rail requirements.
  • Industrial Grade & Temperature Range  Industrial grade device with guaranteed operation from -40°C to 100°C.
  • Regulatory  RoHS compliant.
  • Speed Grade  Device part number includes the I6 speed grade designation consistent with Intel MAX 10 industrial speed grades.

Unique Advantages

  • High logic capacity: 16,000 logic elements enable mid‑density programmable designs without external glue logic.
  • Substantial on‑chip RAM: 562,176 bits of RAM reduce reliance on external memory for buffering and state retention.
  • Generous I/O count: 320 user I/O pins support multiple parallel interfaces and mixed‑signal front ends.
  • Industrial operating range: Rated for -40°C to 100°C operation for deployment in temperature‑challenging environments.
  • Compact BGA packaging: 484‑FBGA (23×23 mm) surface‑mount package simplifies PCB layout for space‑constrained applications.
  • Low‑voltage core compatibility: 1.15 V–1.25 V supply range aligns with modern low‑power system rails.

Why Choose 10M16DCF484I6G?

The 10M16DCF484I6G is positioned for engineers who need a compact, industrial‑grade FPGA with a strong balance of logic density, on‑chip RAM, and versatile I/O in a 484‑ball BGA package. Its specified operating temperature range and RoHS compliance make it suitable for long‑lifecycle embedded applications that require reliable programmable logic in a surface‑mount form factor.

With 16,000 logic elements, over half a million bits of RAM, and 320 I/O, this device supports scalable designs that can consolidate functions, reduce bill‑of‑materials, and simplify board‑level integration while maintaining predictable power and thermal parameters.

Request a quote or submit an inquiry to receive pricing, availability, and technical support details for the 10M16DCF484I6G.

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