10M16DCF484A7G

The 10M16DCF484A7G is a MAX® 10 Field Programmable Gate Array (FPGA) supplied in a 484-BGA surface-mount package. It delivers 16,000 logic elements, 562,176 total RAM bits and 320 I/O to address embedded logic, memory-heavy tasks, and I/O-dense designs.

Designed with automotive-grade qualification (AEC-Q100) and an operating temperature range of −40 °C to 125 °C, this device targets applications that require extended temperature performance and on-chip integration in a compact 484-FBGA (23×23) footprint. The device is RoHS compliant and operates from a 1.15 V to 1.25 V core supply.

Key Features

• Core MAX® 10 FPGA architecture with 16,000 logic elements for implementating combinational and sequential logic.
• Memory 562,176 total RAM bits of on-chip memory suitable for buffering, state storage, and small data arrays.
• I/O 320 general-purpose I/O pins to support high pin-count peripheral and sensor interfaces.
• Power Operates from a 1.15 V to 1.25 V core supply.
• Package & Mounting 484-BGA (supplier package: 484-FBGA, 23×23) surface-mount package for compact, high-density board designs.
• Automotive Qualification & Temperature Range Automotive grade with AEC-Q100 qualification and an operating temperature range of −40 °C to 125 °C for robust deployment.
• Environmental Compliance RoHS compliant for regulatory environmental requirements.

Typical Applications

• Automotive Systems — Electronic control units and sensor hubs that require AEC-Q100 qualification and extended operating temperature capability.
• I/O-Intensive Control — Gateway, telematics or actuator/sensor interface modules leveraging 320 I/O for extensive external connectivity.
• Memory-Dependent Logic — On-chip buffering, packet handling, or stateful control functions using 562,176 RAM bits to minimize external memory.
• Space-Constrained Electronics — Compact, high-density PCB designs that benefit from the 484-FBGA (23×23) surface-mount package.

Unique Advantages

• Automotive-qualified component: AEC-Q100 qualification and automotive grade support deployment in automotive electronic subsystems across −40 °C to 125 °C.
• High logic density: 16,000 logic elements provide capacity for complex control, signal processing, and glue-logic integration.
• Substantial on-chip memory: 562,176 RAM bits reduce dependence on external memory for buffering and local data storage.
• Extensive I/O count: 320 I/O pins simplify integration with multiple sensors, actuators, and peripheral interfaces.
• Compact, solderable package: 484-FBGA (23×23) surface-mount package enables high-density board layouts while maintaining robust electrical connections.
• Regulatory compliance: RoHS compliant for use in regulated manufacturing environments.

Why Choose 10M16DCF484A7G?

The 10M16DCF484A7G combines a balanced mix of logic capacity, on-chip memory and a high I/O count within a compact 484-FBGA package, positioning it for designs that require integration and board-level density. Its AEC-Q100 qualification and extended operating temperature range support applications where environmental robustness and long-term reliability are important.

This device is well suited to engineers developing automotive-grade electronics, I/O-rich control systems, or compact embedded platforms that benefit from significant on-chip RAM and a large number of interfaces while maintaining RoHS compliance and a defined supply voltage range.

Request a quote or submit an inquiry for pricing and availability of the 10M16DCF484A7G to move your design forward.