10M16DCF256C7G

The 10M16DCF256C7G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) in a 256-LBGA package targeted at commercial applications. It combines 16,000 logic elements with 562,176 total RAM bits and 178 I/O pins to support medium-density programmable logic designs.

This surface-mount device operates from a core voltage range of 1.15 V to 1.25 V and is specified for an operating temperature range of 0 °C to 85 °C, making it suitable for commercial-grade embedded systems requiring significant on-chip memory and I/O capacity.

Key Features

• Core Logic 16,000 logic elements provide the programmable fabric for implementing combinational and sequential logic functions.
• On-Chip Memory 562,176 total RAM bits of on-chip memory for buffering, state storage, and on-device data structures.
• I/O Capacity 178 user I/Os to support multiple parallel interfaces and board-level connectivity.
• Package & Mounting 256-LBGA package (supplier device package: 256-FBGA, 17×17) with surface-mount mounting for compact board integration.
• Power Core supply voltage range of 1.15 V to 1.25 V to match system power domains and regulatory requirements for core rail selection.
• Grade & Temperature Commercial grade device rated for operation from 0 °C to 85 °C.
• RoHS Compliance Device is RoHS compliant.

Typical Applications

• Commercial Embedded Systems — Use the device’s 16,000 logic elements and on-chip RAM to implement control, signal processing, and interface logic within commercial equipment.
• Interface Bridging and I/O Expansion — The 178 I/Os enable board-level interface aggregation and protocol bridging in systems that require flexible I/O mapping.
• Prototyping and Evaluation — Medium-density FPGA capacity and a compact 256-LBGA package support hardware prototyping and proof-of-concept designs for commercial products.

Unique Advantages

• Significant Logic Density: 16,000 logic elements allow complex functions and state machines to be implemented on a single FPGA.
• Large On-Chip Memory: 562,176 RAM bits reduce dependency on external memory for many buffering and storage needs.
• High I/O Count: 178 I/Os simplify integration with multiple peripherals and parallel interfaces without additional bridge logic.
• Compact Surface-Mount Package: 256-LBGA (256-FBGA, 17×17) supports space-constrained board designs while providing robust pin density.
• Commercial Temperature Rating: Rated 0 °C to 85 °C for deployments in standard commercial environments.
• RoHS Compliant: Meets environmental compliance requirements for lead-free assembly.

Why Choose 10M16DCF256C7G?

The 10M16DCF256C7G positions itself as a medium-density, commercial-grade FPGA combining ample logic resources, extensive on-chip RAM, and a high I/O count in a compact 256-LBGA package. Its defined core voltage range and commercial temperature rating make it suitable for commercial embedded designs that require integrated logic, memory, and flexible interfacing.

Designers and procurement teams looking for a RoHS-compliant, surface-mount FPGA with clear electrical and packaging specifications will find the 10M16DCF256C7G a practical option for consolidating functionality and reducing external component count.

Request a quote or submit an inquiry to purchase the 10M16DCF256C7G and evaluate how its logic density, memory capacity, and I/O resources fit your next commercial FPGA design.