10M16DAU324I6G

The 10M16DAU324I6G is an Intel MAX® 10 field programmable gate array (FPGA) in a compact 324‑LFBGA (15×15) package. It provides a balance of programmable logic, on‑chip RAM, and a high I/O count for industrial applications that require configurable digital logic and system integration.

With 16,000 logic elements, 562,176 total RAM bits, and an industrial operating temperature range, this device targets designs that need substantial logic density, embedded memory, and robust environmental tolerance while operating from a 1.15 V to 1.25 V core supply.

Key Features

• Logic Capacity  16,000 logic elements for implementing custom digital functions and control logic.
• On‑Chip Memory  562,176 total RAM bits to support buffering, FIFOs, and embedded data storage without external memory.
• I/O Density  246 I/O pins to enable broad peripheral connectivity and interface options in a single device.
• Package  324‑LFBGA (324‑UBGA, 15×15) surface‑mount package for compact board integration.
• Power  Core voltage supply range from 1.15 V to 1.25 V for the device core.
• Industrial Grade and Temperature Range  Specified grade: Industrial; operating temperature range from −40 °C to 100 °C for use in demanding environments.
• RoHS Compliant  Meets RoHS environmental requirements.
• Configuration and System Support (series)  Device family datasheet provides electrical, switching, and configuration specifications for MAX® 10 devices and identifies supported industrial speed grades including −I6.

Typical Applications

• Industrial Control Systems  Use the industrial temperature rating and high I/O count for sensor/actuator interfaces, PLC functions, and machine control logic.
• Interface and Protocol Bridging  Leverage the combination of logic elements and abundant I/Os to implement custom protocol conversion and peripheral bridging on a single device.
• Embedded Data Handling  On‑chip RAM capacity supports buffering, data aggregation, and real‑time data processing tasks without relying on external memory.

Unique Advantages

• High Logic Density: 16,000 logic elements enable implementation of complex custom logic and control functions on a single FPGA.
• Substantial Embedded Memory: 562,176 RAM bits reduce the need for external memory for many buffering and data‑processing tasks.
• Broad I/O Resources: 246 I/Os provide flexibility to connect multiple peripherals, sensors, and communication ports directly to the FPGA.
• Industrial Reliability: Industrial grade device with −40 °C to 100 °C operating range suitable for demanding environments.
• Compact Board Footprint: 324‑LFBGA (15×15) package offers a high‑density solution for space‑constrained designs.
• Low‑Voltage Core: Narrow core supply window (1.15 V to 1.25 V) aligns with modern low‑voltage power architectures.

Why Choose 10M16DAU324I6G?

The 10M16DAU324I6G MAX® 10 FPGA combines significant logic capacity, on‑chip RAM, and a high I/O count in a compact 324‑LFBGA package rated for industrial environments. It is well suited to engineering teams that need a single, programmable device to consolidate custom logic, interface glue logic, and embedded data handling while maintaining a small board footprint.

Backed by the MAX® 10 device family documentation for electrical, switching, and configuration specifications, this part delivers a verifiable platform for designs that demand integration, consistent operating conditions, and RoHS compliance.

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