10M16DAF484I7G

The 10M16DAF484I7G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) provided in a 484-ball BGA package. It integrates 16,000 logic elements, 562,176 total RAM bits and up to 320 I/Os to support mid-density programmable logic designs.

Designed for industrial applications, the device operates from a 1.15 V to 1.25 V core supply and across an operating temperature range of −40 °C to 100 °C. Its surface-mount 484-FBGA (23×23) package offers a compact footprint for space-constrained boards.

Key Features

• Core Logic  16,000 logic elements provide the programmable fabric for implementing custom logic, state machines and glue logic.
• Embedded Memory  562,176 total RAM bits available for on-chip buffering, FIFOs and data storage to support complex designs.
• I/O Capacity  Up to 320 I/Os to connect to peripherals, sensors, buses and external devices with flexible pin availability.
• Power Supply  Specified core voltage range of 1.15 V to 1.25 V for predictable supply requirements in system design.
• Package & Mounting  484-FBGA (23×23) surface-mount package (484-BGA) for compact, board-level integration.
• Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for demanding environments.
• Compliance  RoHS compliant, supporting regulatory and environmental requirements for lead-free assembly.

Typical Applications

• Industrial Control  Leverages the industrial temperature rating and 16,000 logic elements for motor control, PLC logic and process automation tasks.
• Communications & Interfaces  High I/O count and embedded RAM make the device suitable for protocol bridging, interface adaptation and data buffering.
• Embedded Systems  Combines on-chip memory and programmable logic to implement custom peripherals, glue logic and deterministic control functions.

Unique Advantages

• Balanced Logic and Memory:  16,000 logic elements paired with 562,176 RAM bits deliver a balanced resource set for mixed logic and storage needs.
• High I/O Density:  Up to 320 I/Os enable connections to multiple sensors, buses and external devices without external multiplexing.
• Compact BGA Footprint:  484-FBGA (23×23) surface-mount package minimizes board area while maintaining robust pin count for complex designs.
• Industrial Temperature Range:  Rated from −40 °C to 100 °C to support deployments in harsh or temperature-variable environments.
• Defined Core Voltage Window:  1.15 V to 1.25 V supply specification simplifies power-supply selection and margin analysis.
• RoHS Compliant:  Meets lead-free and environmental compliance expectations for product assembly.

Why Choose 10M16DAF484I7G?

The 10M16DAF484I7G positions itself as a versatile mid-density MAX® 10 FPGA from Intel, offering a combination of 16,000 logic elements, over half a million RAM bits and a high I/O count in a compact 484-FBGA package. Its industrial temperature rating and RoHS compliance make it suitable for designs that require reliable operation across temperature extremes and adherence to environmental standards.

This device is well suited for engineers building industrial control, communications interface or embedded system solutions that need a predictable core voltage range, substantial on-chip memory and a large number of I/Os in a surface-mount BGA footprint.

Request a quote or contact sales to discuss availability, pricing and delivery for the 10M16DAF484I7G.