10M16DAF484I7P

The 10M16DAF484I7P is an Intel MAX® 10 Field Programmable Gate Array supplied in a 484-ball fine-pitch BGA (23 × 23) package. It provides a balanced combination of logic capacity, on-chip memory, and I/O density for industrial-grade FPGA designs.

Key device characteristics include 16,000 logic elements, 562,176 total RAM bits, 320 I/O pins, a supply voltage range of 1.15 V to 1.25 V, and an operating temperature range of −40 °C to 100 °C—all packaged for surface-mount assembly and RoHS-compliant.

Key Features

• Core Capacity  16,000 logic elements provide the programmable logic resources needed for mid-density designs and custom hardware acceleration.
• On-Chip Memory  562,176 total RAM bits enable local data storage and buffering without external memory for many embedded functions.
• I/O Density  320 general-purpose I/O pins support extensive peripheral interfacing and multi-channel connectivity requirements.
• Package & Mounting  484-FBGA (23 × 23) package supplied as a surface-mount device for compact PCB layouts and reliable soldered connections.
• Power  Nominal core supply range of 1.15 V to 1.25 V to match system power-rail requirements.
• Temperature Range  Industrial-grade operating range from −40 °C to 100 °C suitable for deployments requiring extended ambient tolerance.
• Regulatory Status  RoHS-compliant to support environmental and production requirements.

Unique Advantages

• Substantial Logic Resources: 16,000 logic elements provide room for complex control, signal-processing, or interface logic within a single device.
• Generous On-Chip Memory: Over half a million RAM bits reduce reliance on external memory for buffering and state storage.
• High I/O Count: 320 I/O pins enable dense peripheral and bus connectivity without external expanders.
• Industrial Temperature Rating: Specified −40 °C to 100 °C operation supports systems exposed to wide ambient conditions.
• Compact BGA Packaging: 484-FBGA 23 × 23 footprint offers a compact form factor for space-constrained boards while maintaining signal integrity.
• Low-Voltage Core: 1.15 V–1.25 V supply compatibility aligns with common system power architectures.

Why Choose 10M16DAF484I7P?

The 10M16DAF484I7P positions itself as an industrial-grade FPGA option focusing on mid-density logic integration with substantial on-chip memory and high I/O capacity. Its combination of 16,000 logic elements, 562,176 RAM bits, and 320 I/Os in a compact 484-FBGA package suits designs that require significant programmable logic and local memory while maintaining a small PCB footprint.

This device is appropriate for teams and projects that need predictable temperature tolerance and RoHS compliance, a defined low-voltage core supply window, and a surface-mount BGA package for production-ready assembly. It delivers a clear, spec-driven choice for embedded and industrial FPGA implementations.

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