10M16DAU324I7G

The Intel MAX® 10 FPGA 10M16DAU324I7G is a field-programmable gate array in a 324-LFBGA (324-UBGA 15×15) package designed for industrial-grade applications. It integrates 16,000 logic elements, 562,176 bits of on-chip RAM and up to 246 I/O pins to support complex, reconfigurable logic and memory functions in space-constrained designs.

With a core supply range of 1.15 V to 1.25 V and an operating temperature range of −40 °C to 100 °C, this device is specified for extended-temperature environments while maintaining RoHS compliance.

Key Features

• Core & logic — 16,000 logic elements provide fabric capacity for implementing custom logic, signal processing, and control functions.
• On-chip memory — 562,176 total RAM bits enable local buffering, lookup tables, and state storage without external memory in many designs.
• I/O density & package — Up to 246 I/O pins in a 324-LFBGA (324-UBGA, 15×15) package for dense connectivity to sensors, peripherals, and external devices.
• Power — Core voltage supply specified at 1.15 V to 1.25 V for systems designed around low-voltage FPGA cores.
• Industrial temperature range — Specified operation from −40 °C to 100 °C for deployment in extended-temperature environments.
• Compliance — RoHS compliant to support environmental and regulatory requirements.

Typical Applications

• Industrial control — Reconfigurable logic and sizeable on-chip RAM support control algorithms, I/O aggregation, and deterministic processing in industrial systems operating across a wide temperature range.
• Embedded processing — On-chip memory and 16,000 logic elements enable implementation of custom data-paths, protocol handling, and peripheral interfacing for embedded applications.
• I/O expansion and bridging — Up to 246 I/O pins in a compact 324-LFBGA package allow the device to serve as a high-density interface bridge or I/O concentrator in constrained form factors.

Unique Advantages

• Balanced integration: Combines substantial logic capacity with large on-chip RAM (562,176 bits) to reduce dependence on external memory and simplify BOM.
• High I/O count in a compact package: 246 I/O pins in a 324-LFBGA (15×15 UBGA) package deliver dense connectivity while conserving board space.
• Designed for extended temperatures: Industrial-grade operation from −40 °C to 100 °C supports reliable operation in demanding environments.
• Low-voltage core: Specified 1.15 V to 1.25 V supply simplifies power-rail planning for modern low-voltage systems.
• Regulatory-ready: RoHS compliance facilitates integration into products with environmental compliance requirements.

Why Choose 10M16DAU324I7G?

The 10M16DAU324I7G delivers a practical combination of logic capacity, on-chip RAM, and high I/O count in a compact 324-LFBGA package tailored for industrial-temperature applications. Its specification set is well suited to designers who need reconfigurable logic with substantial local memory and dense external connectivity while operating across an extended temperature range.

This device is a fit for teams building embedded and industrial systems that prioritize integration, board-space efficiency, and environmental compliance, offering a clear set of verifiable specifications to guide system-level decisions.

Request a quote or submit an inquiry to obtain pricing and availability for the 10M16DAU324I7G.