10M16DAU324I7P

The 10M16DAU324I7P is an Intel MAX® 10 Field Programmable Gate Array offered in a 324-LFBGA package. It provides a mid-range integration point with 16,000 logic elements, 562,176 total RAM bits and 246 user I/O pins for reconfigurable digital logic implementations.

Designed and specified for industrial-grade use, the device supports a 1.15 V to 1.25 V core supply and an operating temperature range of −40 °C to 100 °C, making it suitable for applications that require robust thermal performance and dense I/O in a compact surface-mount package.

Key Features

• Core Logic  16,000 logic elements provide the programmable fabric for implementing custom digital functions and state machines.
• On‑Chip Memory  562,176 total RAM bits for embedded buffering, lookup tables and temporary storage within the FPGA fabric.
• I/O Capacity  246 user I/O pins to support extensive peripheral interfacing and parallel connectivity in dense designs.
• Package & Mounting  324-LFBGA package (supplier device package: 324-UBGA, 15 × 15 mm) in a surface-mount form factor for compact board-level integration.
• Power  Specified core supply voltage range of 1.15 V to 1.25 V for predictable power sequencing and system design.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in temperature-challenging environments.
• Environmental Compliance  RoHS compliant to meet lead-free assembly and environmental requirements.

Typical Applications

• Industrial systems  Reconfigurable logic for industrial control and automation where industrial-grade temperature range and robust I/O are required.
• Compact, high‑I/O designs  Board-level solutions that need a high I/O count in a 15 × 15 mm UBGA footprint for space-constrained layouts.
• Mid‑range FPGA implementations  Designs that require moderate logic density and on-chip RAM to implement custom processing, interfacing, or control functions.

Unique Advantages

• Balanced logic capacity: 16,000 logic elements deliver a mid-range resource set suitable for a wide range of custom logic tasks without overprovisioning.
• Significant on-chip RAM: 562,176 total RAM bits enable local buffering and data handling inside the FPGA fabric, reducing external memory dependence.
• High I/O count: 246 I/Os give designers flexibility to connect multiple peripherals, sensors, or parallel data paths directly to the FPGA.
• Industrial temperature rating: −40 °C to 100 °C operation allows deployment in environments with wide temperature swings.
• Compact BGA package: 324-LFBGA (324-UBGA, 15 × 15 mm) supports dense, space-efficient board layouts while enabling high pin counts.
• RoHS compliant: Meets lead-free and environmental compliance requirements for modern assembly processes.

Why Choose 10M16DAU324I7P?

The 10M16DAU324I7P positions itself as a practical mid-range FPGA solution that combines 16,000 logic elements, substantial on-chip RAM, and a high I/O count in a compact 324-LFBGA package. Its industrial-grade temperature rating and defined core supply range make it suitable for systems requiring reliable operation across a wide thermal range.

This device is appropriate for designers seeking a reconfigurable, space-efficient FPGA with enough logic and memory resources to implement complex interfacing and control functions while maintaining compliance with RoHS requirements.

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