10M16DCF256A7G

The 10M16DCF256A7G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) IC provided in a 256-LBGA package. It combines 16,000 logic elements with on-chip RAM and a high count of programmable I/O, offering a compact, reconfigurable platform for embedded and automotive-grade applications.

Qualified to AEC‑Q100 and rated for operation from -40 °C to 125 °C, this device targets designs that require robust thermal performance and automotive-grade reliability while operating from a 1.15 V to 1.25 V core supply.

Key Features

• Logic Capacity — 16,000 logic elements provide reconfigurable digital logic resources for implementing custom functions and control logic.
• On‑chip Memory — 562,176 total RAM bits for data buffering, state storage, and application-specific memory needs.
• Programmable I/O — 178 I/Os to support a wide range of peripheral interfaces and board-level connectivity options.
• Automotive Qualification — AEC‑Q100 qualification and an automotive grade designation for use in designs requiring recognized component-level automotive qualification.
• Extended Temperature Range — Rated for operation from -40 °C to 125 °C to support demanding environmental conditions.
• Power Supply — Core voltage range of 1.15 V to 1.25 V for predictable power budgeting and integration into regulated power domains.
• Package & Mounting — 256‑LBGA (supplier package: 256‑FBGA, 17 × 17 mm) in a surface-mount form factor for compact board-level integration.

Typical Applications

• Automotive Systems — Use in vehicle electronics where AEC‑Q100 qualification and -40 °C to 125 °C operation are required for control, sensing, or data handling functions.
• Embedded Control — Reprogrammable logic and on-chip RAM support custom control algorithms, timing-critical logic, and event handling.
• High‑I/O Interfaces — The 178 I/Os enable aggregation and bridging of multiple peripherals, sensors, or communication lanes on a single device.

Unique Advantages

• Automotive‑grade Reliability: AEC‑Q100 qualification combined with extended temperature rating supports deployment in automotive and other harsh environments.
• Balanced Logic and Memory: 16,000 logic elements paired with 562,176 RAM bits enables complex control and buffering functions without external memory.
• High I/O Count: 178 programmable I/Os reduce the need for additional interface components and simplify board-level connectivity.
• Compact, Surface‑Mount BGA: 256‑LBGA (17 × 17 mm) package delivers a high-density solution for space-constrained PCBs.
• Low‑voltage Core: 1.15 V to 1.25 V core supply range helps align the FPGA with modern low-voltage power domains.

Why Choose 10M16DCF256A7G?

The 10M16DCF256A7G positions itself as a compact, automotive-qualified FPGA option that combines a substantial logic element count, significant on-chip RAM, and a high I/O density. Its AEC‑Q100 qualification and extended operating temperature range make it suitable for designs that require recognized automotive-level component qualification and robust thermal performance.

Engineers and procurement teams seeking a reconfigurable device with clear, verifiable specifications for logic capacity, memory, I/O count, package, and operating conditions will find this FPGA well suited to embedded control, sensor aggregation, and automotive electronics applications where component-level qualification matters.

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