10M16DCF256C8G

The 10M16DCF256C8G is an Intel MAX® 10 field programmable gate array (FPGA) supplied in a 256-ball BGA package. It provides a balance of programmable logic, on-chip RAM, and I/O density for commercial embedded and digital designs.

With 16,000 logic elements, 562,176 bits of total RAM, and 178 I/O, this device is tailored for designs that require moderate logic capacity, substantial on-chip memory, and a high number of external interfaces while operating within a commercial temperature range.

Key Features

• Core Logic 16,000 logic elements designed to implement custom digital functions and glue logic for embedded systems.
• On‑Chip Memory 562,176 total RAM bits to store buffers, FIFOs, and state data without external memory in many use cases.
• I/O Density 178 user I/O pins to support broad peripheral connectivity and parallel interface requirements.
• Power Supply Core voltage supply requirement of 1.15 V to 1.25 V for device operation.
• Package & Mounting 256-LBGA package case; supplier package listed as 256-FBGA (17×17). Device is intended for surface-mount assembly.
• Operating Range Commercial-grade operating temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS-compliant material status for regulatory alignment in many commercial products.

Typical Applications

• Custom digital logic and glue functionality — Implement control, protocol conversion, and bespoke logic blocks using up to 16,000 logic elements and plentiful on-chip RAM.
• High–I/O peripheral aggregation — Aggregate and interface numerous peripherals or sensors using the device’s 178 user I/Os.
• Buffering and packet processing — Use the 562,176 bits of RAM for packet buffers, FIFOs, and data staging in data-path and communication designs.

Unique Advantages

• Balanced logic and memory resources: 16,000 logic elements combined with 562,176 bits of RAM provide designers flexibility to implement both control and data-path functions on a single device.
• High external interface capacity: 178 I/O pins enable complex multi‑signal interfaces and parallel peripheral connectivity without immediate need for expansion logic.
• Compact BGA packaging for space-constrained boards: 256-ball LBGA/FBGA (17×17) packaging supports surface-mount assembly and high-density PCB layouts.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to meet standard commercial environment requirements.
• RoHS compliance: Material compliance simplifies environmental declarations and regulatory considerations.

Why Choose 10M16DCF256C8G?

The 10M16DCF256C8G positions itself as a versatile commercial-grade FPGA option for designs that require a mid-range combination of logic capacity, on-chip RAM, and high I/O count. Its specifications make it suitable for embedded control, interface aggregation, and data buffering tasks where integration and board density matter.

Choosing this MAX® 10 device lets teams consolidate logic and memory functions into a single, RoHS-compliant surface-mount package while staying within a commercial operating temperature and a defined core voltage range.

Request a quote or submit an inquiry for pricing and availability for the 10M16DCF256C8G to evaluate it for your next design.