10M16DCF256I6G

The 10M16DCF256I6G is an Intel MAX® 10 field programmable gate array (FPGA) supplied in a 256-ball BGA package. It combines a mid-range logic capacity with on-chip RAM and a high I/O count to address industrial embedded applications.

Key device attributes include 16,000 logic elements, 562,176 bits of RAM, up to 178 I/Os, a 1.15 V–1.25 V core supply range, and an industrial operating temperature range of −40 °C to 100 °C, making it suitable for designs that require a balance of integration and ruggedness.

Key Features

• Core Logic  16,000 logic elements provide the programmable fabric for implementing custom digital functions and control logic.
• On‑Chip Memory  562,176 total RAM bits for buffering, state storage, and intermediate data processing within the FPGA.
• I/O Capacity  Up to 178 I/O pins to support multiple external interfaces and sensor/actuator connections.
• Power  Core supply voltage range of 1.15 V to 1.25 V for compatibility with low‑voltage FPGA power domains.
• Package  256‑LBGA package (supplier device package noted as 256‑FBGA, 17×17) for compact board-level integration.
• Operating Range  Industrial temperature rating from −40 °C to 100 °C for deployment in demanding environments.
• Mounting  Surface mount device suited to standard SMT assembly processes.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Use in industrial automation systems where the device’s industrial temperature range and I/O count support rugged control and monitoring tasks.
• Embedded Processing  Implement mid-range custom logic and data handling using the device’s 16,000 logic elements and on‑chip RAM.
• Interface and I/O Aggregation  Consolidate multiple peripheral interfaces and sensor connections using the FPGA’s 178 available I/Os.

Unique Advantages

• Balanced Logic and Memory: 16,000 logic elements paired with 562,176 bits of RAM support a wide range of mid‑complexity designs without external memory for many use cases.
• High I/O Density: 178 I/Os allow flexible interfacing to sensors, actuators, and communication peripherals.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in thermally challenging environments.
• Compact BGA Footprint: 256-ball BGA (supplier: 256‑FBGA, 17×17) enables high‑density board layouts while keeping the component count low.
• Low‑Voltage Core Compatibility: 1.15 V–1.25 V supply range aligns with common low-voltage FPGA power architectures.
• Regulatory Compliance: RoHS compliance eases integration into products targeting regulatory-restricted markets.

Why Choose 10M16DCF256I6G?

The 10M16DCF256I6G is positioned for designers seeking a mid-range FPGA that balances logic density, embedded RAM, and a high I/O count in a compact BGA package. Its industrial temperature rating and RoHS compliance make it suitable for embedded and industrial projects that require reliable operation across a wide thermal range.

Choose this device for designs that need a predictable, integrated FPGA building block capable of supporting custom control, interface consolidation, and embedded data buffering within the constraints of a 256‑ball BGA footprint and low-voltage core supply.

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