10M16DCF256I7G
| Part Description |
MAX® 10 Field Programmable Gate Array (FPGA) IC 178 562176 16000 256-LBGA |
|---|---|
| Quantity | 411 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 178 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1000 | Number of Logic Elements/Cells | 16000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 562176 |
Overview of 10M16DCF256I7G – MAX® 10 FPGA IC 256-LBGA
The 10M16DCF256I7G is an Intel MAX® 10 field-programmable gate array offered in a 256-ball BGA package. It provides a measurable integration point for industrial-grade embedded designs, combining programmable logic, on-chip memory, and flexible I/O in a surface-mount footprint.
With 16,000 logic elements and 562,176 bits of on-chip RAM, this device targets applications that require mid-range logic density, substantial local memory, and up to 178 I/O signals while operating across an industrial temperature range.
Key Features
- Logic Capacity — 16,000 logic elements for implementing mid-density programmable logic and control functions.
- On-chip Memory — 562,176 total RAM bits to support buffering, local storage, and state machines without external memory.
- I/O Count — 178 general-purpose I/O pins to connect multiple peripherals, sensors, or interfaces directly to the device.
- Packaging & Mounting — Available in a 256-LBGA package; supplier device package listed as 256-FBGA (17×17). Surface-mount mounting type for PCB assembly.
- Power — Voltage supply range from 1.15 V to 1.25 V as specified for device operation.
- Temperature & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C.
- Compliance — RoHS compliant.
- Documentation — Device datasheet covers electrical characteristics, switching characteristics, configuration specifications, and timing.
Unique Advantages
- High logic density: 16,000 logic elements enable implementation of substantial programmable functions without moving to higher-density devices.
- Significant on-chip RAM: 562,176 bits of RAM reduce reliance on external memory for buffering and local data storage.
- Generous I/O availability: 178 I/Os provide flexibility for connecting multiple peripherals, interfaces, and sensors directly to the FPGA.
- Industrial temperature support: Rated for −40 °C to 100 °C, suitable for environments requiring extended temperature operation.
- Compact surface-mount package: 256-ball BGA (256-FBGA 17×17) balances PCB area and pin count for integration into compact assemblies.
- Low-voltage core operation: 1.15 V to 1.25 V supply range aligns with low-voltage system designs.
Why Choose 10M16DCF256I7G?
The 10M16DCF256I7G positions itself as an industrial-grade FPGA solution delivering a balanced combination of logic capacity, on-chip RAM, and I/O resources in a compact BGA package. Its specified operating temperature range and RoHS compliance make it suitable for industrial embedded designs that require reliable, programmable logic with substantial local memory.
This device is appropriate for engineers and procurement teams seeking a mid-density FPGA that provides clear, verifiable specifications for logic elements, memory, I/O, power, and package—supporting designs that need scalable programmability within an industrial temperature window.
Request a quote or submit a procurement inquiry for the 10M16DCF256I7G to obtain pricing and availability information.

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