10M16DAU324C8G

IC FPGA 246 I/O 324UBGA
Part Description

MAX® 10 Field Programmable Gate Array (FPGA) IC 246 562176 16000 324-LFBGA

Quantity 976 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package324-UBGA (15x15)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-LFBGANumber of I/O246Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1000Number of Logic Elements/Cells16000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits562176

Overview of 10M16DAU324C8G – MAX® 10 FPGA, 16,000 logic elements, 562,176 RAM bits, 246 I/Os, 324-LFBGA

The 10M16DAU324C8G is an Intel MAX® 10 field programmable gate array (FPGA) in a 324‑LFBGA package. This device provides 16,000 logic elements and 562,176 bits of on-chip RAM combined with up to 246 general-purpose I/Os for mid-density programmable logic applications.

Designed for surface-mount implementation and commercial-grade operation, the device operates from a supply voltage range of 1.15 V to 1.25 V and an ambient temperature range of 0 °C to 85 °C. The accompanying Intel MAX 10 device datasheet documents configuration, electrical, and timing specifications for system integration.

Key Features

  • Logic Capacity — 16,000 logic elements provide mid-density programmable logic resources for custom digital designs.
  • On‑Chip Memory — 562,176 bits of total RAM enable local buffering, FIFOs, and small embedded data storage without external memory.
  • I/O Resources — Up to 246 I/O pins support a wide range of peripheral interfacing and system signals.
  • Power — Core supply range of 1.15 V to 1.25 V for designs targeting the Intel MAX 10 voltage domain.
  • Package and Mounting — 324‑LFBGA (supplier package: 324‑UBGA, 15×15) in a surface-mount form factor for high-density PCB layouts.
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operation suitable for commercial applications.
  • Programmable I/O Timing — Datasheet includes programmable I/O delay and timing configuration options for interface tuning.
  • Compliance — RoHS‑compliant manufacturing and materials.

Unique Advantages

  • Balanced Resource Set: Combines 16,000 logic elements with over half a million bits of on-chip RAM to support both control logic and local data buffering without immediate external memory.
  • High I/O Count: 246 I/Os enable complex multi-signal interfaces and flexible connectivity to peripherals and board-level components.
  • Compact Package: 324‑LFBGA (15×15 UBGA footprint) offers a high-density package option for space-constrained PCB designs.
  • Commercial Temperature Rating: Specified 0 °C to 85 °C operation aligns with a wide range of commercial/industrial-adjacent deployments.
  • Design Integration Support: Detailed datasheet coverage of electrical, switching, configuration, and timing characteristics aids accurate system-level integration and validation.
  • Regulatory Compliance: RoHS status supports lead-free, environmentally compliant product builds.

Why Choose 10M16DAU324C8G?

The 10M16DAU324C8G positions itself as a mid-density Intel MAX 10 FPGA option for designers who need a balanced combination of programmable logic, on-chip RAM, and a substantial I/O count in a compact surface-mount package. Its defined supply voltage range and commercial temperature rating make it suitable for commercial electronic products requiring integrated logic and memory resources.

With full datasheet coverage of configuration, timing, and electrical characteristics, this device is appropriate for teams that require verifiable specifications to support PCB integration, timing closure, and system-level testing.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the 10M16DAU324C8G.

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