10M16DAF484C8G

The 10M16DAF484C8G is a MAX® 10 field programmable gate array offered in a 484-FBGA (23×23) surface-mount package. The device provides 16,000 logic elements, 562,176 bits of on-chip RAM, and up to 320 I/O pins, making it suitable for mid-density FPGA designs.

Designed as a commercial-grade component, this FPGA operates from a 1.15 V to 1.25 V core supply and across an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant and packaged in a 484-BGA footprint for compact PCB integration.

Key Features

• Core Logic  Provides 16,000 logic elements to implement custom digital logic, state machines, and combinational/sequential functions.
• On-chip Memory  Includes 562,176 total RAM bits for buffering, FIFOs, and intermediate data storage without external memory.
• I/O Capacity  Up to 320 I/O pins to support broad connectivity options for peripherals, buses, and external interfaces.
• Power  Core voltage range of 1.15 V to 1.25 V to match system power-rail requirements and ensure predictable supply conditions.
• Package  484-FBGA (23×23) surface-mount package (484-BGA) for compact board-level integration.
• Grade and Environmental  Commercial grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance for environmental regulatory requirements.

Typical Applications

• Commercial Embedded Systems  For designs requiring up to 16,000 logic elements and high on-chip RAM capacity in a compact 484-FBGA package.
• Interface and I/O Expansion  Use where a large I/O count (up to 320 pins) is needed to bridge or aggregate multiple peripheral interfaces.
• Data Buffering and Signal Processing  On-chip RAM (562,176 bits) supports buffering, streaming, and intermediate data processing without external memory.
• Compact PCB Designs  Surface-mount 484-FBGA package suits space-constrained commercial products that require substantial logic and I/O in a single device.

Unique Advantages

• Balanced Logic and Memory:  16,000 logic elements combined with 562,176 RAM bits provide a versatile mix for control logic and data-handling tasks.
• High I/O Density:  Up to 320 I/O pins enable extensive peripheral connectivity without multiple interface chips.
• Compact Packaging:  484-FBGA (23×23) package allows high integration density for space-sensitive boards.
• Commercial Temperature Suitability:  Rated for 0 °C to 85 °C operation to match common commercial applications and environments.
• Regulatory Compliance:  RoHS compliant to support environmentally conscious product designs and supply-chain requirements.

Why Choose 10M16DAF484C8G?

The 10M16DAF484C8G delivers a practical balance of logic density, on-chip memory, and I/O capacity in a single commercial-grade FPGA package. Its 16,000 logic elements and more than half a million RAM bits enable a wide range of mid-density designs requiring both control logic and data buffering without immediate need for external memory.

This device is well suited for product teams and engineers designing commercial embedded systems that require compact packaging, significant I/O connectivity, and predictable operating conditions. Its RoHS compliance and standard surface-mount 484-FBGA form factor make it straightforward to integrate into modern PCB assemblies while meeting environmental regulations.

Request a quote or submit a procurement inquiry to get pricing and availability for the 10M16DAF484C8G.