10M16DAF256I6G

The 10M16DAF256I6G is a MAX® 10 Field Programmable Gate Array (FPGA) IC in a 256‑LBGA package designed for industrial applications. It combines 16,000 logic elements with on‑chip memory and a broad I/O count to address programmable-logic tasks where integration and rugged operating range are required.

Key electrical and environmental characteristics include a supply voltage range of 1.15 V to 1.25 V and an operating temperature range of −40 °C to 100 °C, making the device suitable for industrial-temperature systems that need field‑programmable logic and embedded RAM resources.

Key Features

• Core Logic  16,000 logic elements provide the fabric for custom digital logic, state machines, and glue logic.
• On‑chip Memory  562,176 total RAM bits for buffering, FIFOs, and small local data structures without immediate need for external memory.
• I/O Density  178 I/O pins support extensive external interfacing for sensors, peripherals, and parallel/serial connections.
• Power  Nominal core supply range of 1.15 V to 1.25 V to match system-level power architectures.
• Package & Mounting  256‑LBGA package; supplier device package listed as 256‑FBGA (17×17). Surface mount package suitable for standard PCB assembly.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C.
• Compliance  RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

• Industrial Control  Programmable logic functions for control and automation systems that require an industrial temperature range and on‑device configurability.
• I/O‑Intensive Embedded Systems  High I/O count (178) supports designs with multiple sensors, actuators, and peripheral interfaces directly connected to the FPGA.
• On‑Chip Buffering and Signal Handling  Use the 562,176 bits of embedded RAM for data buffering, small look‑up tables, and real‑time data manipulation without external memory.

Unique Advantages

• Integrated Logic and Memory  Combining 16,000 logic elements with over half a million bits of RAM reduces dependence on external components for many control and signal‑processing tasks.
• High I/O Count  178 I/Os enable direct connections to a wide range of peripherals and interfaces, simplifying board-level routing and reducing the need for GPIO expanders.
• Industrial Temperature Range  Rated from −40 °C to 100 °C to meet environmental requirements for industrial deployments.
• Compact Surface‑Mount Package  256‑LBGA (256‑FBGA, 17×17) offers a high‑density package option compatible with standard surface‑mount assembly processes.
• Controlled Core Voltage  A defined supply window (1.15 V–1.25 V) enables predictable power integration and system design planning.
• RoHS‑Compliant  Meets common regulatory manufacturing requirements for lead‑free designs.

Why Choose 10M16DAF256I6G?

The 10M16DAF256I6G is positioned for industrial embedded designs that need a balance of programmable logic capacity, embedded RAM, and a substantial I/O complement in a compact surface‑mount package. Its specified operating voltage range and industrial temperature rating make it suitable for systems where stability across varying temperatures and predictable power requirements matter.

As part of the MAX® 10 FPGA family, the device is documented in the device datasheet for electrical, switching, and configuration specifications, allowing engineers to integrate it into designs with known, verifiable parameters for logic capacity, memory, I/O, and environmental limits.

If you would like pricing or availability information, request a quote or submit a request to your procurement channel with the part number 10M16DAF256I6G and required quantities.